Highly integrated image sensors using inter-substrate wiring structures

1 . An image sensor, comprising:

a first semiconductor substrate having a first transistor integrated therein;

a first plurality of wiring structures on the first semiconductor substrate, said first plurality of wiring structures including a first wiring structure electrically connected to the first transistor;

a second semiconductor substrate on the first plurality of wiring structures, said second semiconductor substrate having a second transistor integrated therein, which is electrically connected to a second wiring structure within the first plurality of wiring structures;

a second plurality of wiring structures on the second semiconductor substrate;

a third semiconductor substrate on the second plurality of wiring structures;

a microlens on a light receiving surface of the third semiconductor substrate;

a light sensing element within the third semiconductor substrate;

a transfer gate (TG) extending into a portion of the third semiconductor substrate, said TG extending adjacent the light sensing element and electrically connected to a first wiring structure within the second plurality of wiring structures;

a floating diffusion (FD) region extending within the third semiconductor substrate and adjacent the TG, said FD region electrically connected to a second wiring structure within the second plurality of wiring structures;

a first through-electrode, which extends through the second semiconductor substrate and is electrically connected to the second transistor; and

an adhesion layer between the second semiconductor substrate and the third semiconductor substrate, the adhesion layer having an adhesion pad electrically connected to the first through-electrode, and the adhesion pad having an adhesion surface that is wider, in a direction parallel to the second semiconductor substrate, than the first through-electrode.

2 . The image sensor of claim 1 , further comprising:

a second through-electrode, which extends through the second semiconductor substrate and electrically connects a wiring structure within the second plurality of wiring structures to a wiring structure within the first plurality of wiring structures.

3 . The image sensor of claim 1 , further comprising a color filter array layer extending between the microlens and the third semiconductor substrate.

4 . The image sensor of claim 1 , wherein the first plurality of wiring structures are embedded within a first electrically insulating material(s); and wherein the second plurality of wiring structures are embedded within a second electrically insulating material(s).

5 . The image sensor of claim 4 , wherein at least some of the first plurality of wiring structures are bonded together so that electrical signals are passed between the first and second semiconductor substrates; and wherein at least some of the second plurality of wiring structures are bonded together so that electrical signals are passed between the second and third semiconductor substrates.

6 . The image sensor of claim 4 , further comprising an opening, which extends through the third semiconductor substrate and the second electrically insulating material(s).

7 . The image sensor of claim 6 , wherein the opening exposes an I/O pad within the second semiconductor substrate.

8 . The image sensor of claim 1 , further comprising a pixel division structure, which extends through the third semiconductor substrate and defines a unit pixel region therein.

9 . The image sensor of claim 8 , wherein the second transistor is a source follower transistor; wherein the image sensor further comprises a select transistor and a reset transistor beneath the second substrate; and wherein the select transistor and the reset transistor are spaced apart from each other in a first direction parallel to an upper surface of the first substrate, and the source follower transistor is spaced apart from the select transistor or the reset transistor in a second direction parallel to the upper surface of the first substrate and crossing the first direction.

10 . The image sensor of claim 1 , wherein the second transistor is configured as a source follower transistor.

11 . The image sensor of claim 10 , wherein the second semiconductor substrate further comprises a select transistor and a reset transistor therein, which are associated with a corresponding unit pixel within the third semiconductor substrate.

12 . An image sensor, comprising:

a first substrate having a first transistor thereon;

a first wiring electrically connected to the first transistor, on the first substrate;

second and third wirings on the first wiring;

a second substrate on the second and third wirings, the second substrate having a second transistor therein, which is electrically connected to the second wiring;

fourth and fifth wirings on the second substrate;

a third substrate on the fourth and fifth wirings;

a color filter array layer having color filters therein, on the third substrate;

a microlens on the color filter array layer;

a light sensing element in the third substrate;

a transfer gate (TG) extending through a lower portion of the third substrate, the TG extending adjacent to the light sensing element and electrically connected to the fourth wiring;

a floating diffusion (FD) region at a lower portion of the third substrate adjacent to the TG, the FD region being electrically connected to the fifth wiring;

a first through-electrode extending through the second substrate, the first through-electrode being electrically connected to the second transistor and the fifth wiring; and

a second through-electrode extending through the second substrate, the second through-electrode contacting the first and third wirings and being electrically connected to the fourth wiring, and the second through-electrode being spaced, in a direction parallel to the second substrate, from the microlens.

13 . The image sensor of claim 12 , wherein the first through-electrode contacts an upper surface of the second wiring; and wherein the image sensor further comprises a first adhesion pad, which contacts an upper surface of the first through-electrode and is electrically connected to the fifth wiring.

14 . The image sensor of claim 13 , further comprising a second adhesion pad at the same level as that of the first adhesion pad, the second adhesion pad being electrically connected to the second through-electrode and the fourth wiring.

15 . The image sensor of claim 12 , further comprising:

a third transistor; and

a sixth wiring at a level lower than that of the second wiring, the sixth wiring being electrically connected to the third transistor, and at least a portion of the sixth wiring overlapping the second wiring in a vertical direction perpendicular to an upper surface of the first substrate.

16 . The image sensor of claim 12 ,

wherein the first, second and third substrates are sequentially stacked in a vertical direction, and commonly include a pixel region, a connection region surrounding the pixel region, and a pad region surrounding the connection region;

wherein the color filter array layer and the microlens are formed in the pixel region;

wherein the image sensor further includes a pixel division structure extending through the third substrate in the pixel region and defining unit pixel regions in which unit pixels are formed, respectively; and

wherein the light sensing element and the TG are formed in each of the unit pixel regions.

17 . The image sensor of claim 16 , wherein the FD region is commonly formed in portions of four neighboring pixel regions among the pixel regions; and wherein the first through-electrode overlaps the FD region in the vertical direction.

18 . The image sensor of claim 16 ,

wherein the second and fifth wirings and the first through-electrode are formed in the pixel region, the second through-electrode is formed in the connection region, and the fourth wiring is commonly formed in the pixel region and the connection region, and

wherein the image sensor further comprises:

a first adhesion pad in the pixel region, the first adhesion pad contacting an upper surface of the first through-electrode and being electrically connected to the fifth wiring; and

a second adhesion pad at the same level as that of the first adhesion pad in the connection region, the second adhesion pad being electrically connected to the second through-electrode and the fourth wiring.

19 . The image sensor of claim 16 ,

wherein the first and third wirings are formed in the connection region; and

wherein the image sensor further comprises:

a sixth wiring in the pad region on the first substrate, the sixth wiring being spaced apart from the first wiring;

a third through-electrode extending through the second substrate and contacting the sixth wiring; and

an I/O pad in the pad region in the second substrate, the I/O pad being electrically connected to the third through-electrode.

20 . An image sensor, comprising:

first, second and third substrates sequentially stacked in a vertical direction, the first, second and third substrates commonly including a pixel region and a connection region surrounding the pixel region, and the connection region including connection wirings for transferring electrical signals in the vertical direction;

a first transistor beneath the second substrate in the pixel region;

a first wiring under the first transistor in the pixel region, the first wiring being electrically connected to the first transistor;

a second wiring under the second substrate in the connection region;

a first through-electrode extending through the second substrate in the pixel region, the first through-electrode being electrically connected to the first wiring;

a second through-electrode extending through the second substrate in the connection region, the second through-electrode being electrically connected to the second wiring;

first and second adhesion pads on the second substrate, the first and second adhesion pads being electrically connected to the first and second through-electrodes, respectively, and the first and second adhesion pads being in the pixel region and the connection regions, respectively;

third and fourth wirings on and electrically connected to the first and second adhesion pads, respectively, said fourth wiring extending from the pixel region to the connection region;

a light sensing element in the third substrate;

a transfer gate (TG) extending through a lower portion of the third substrate, the TG being adjacent to the light sensing element in the pixel region and electrically connected to the fourth wiring; and

a floating diffusion (FD) region at a lower portion of the third substrate adjacent to the TG, the FD region being electrically connected to the third wiring,

wherein the second through-electrode is configured to provide a control signal to the TG.