LED structure and GaN-based substrate thereof, and method for manufacturing GaN-based substrate
The present application provides an LED structure and a GaN-based substrate thereof, and a method for manufacturing a GaN-based substrate. The GaN-based substrate includes: a patterned base including a plurality of depressions and a plurality of protrusions; a metal Ga layer located at the plurality of depressions; and a second semiconductor layer located on the metal Ga layer and the plurality of protrusions exposed by the metal Ga layer, where a material for the second semiconductor layer is a GaN-based material. When the LED light-emitting structure is formed on the GaN-based substrate, light emitted by the LED light-emitting structure, after being reflected via the metal Ga layer, can emit from an upper surface or a side surface of the LED light-emitting structure, which reduces the light absorption and further improves the light-emitting efficiency of the LED light-emitting structure.
1 . A method of manufacturing a GaN-based substrate, comprising:
providing a patterned base comprising a plurality of depressions and a plurality of protrusions;
epitaxially growing a first semiconductor layer in the plurality of depressions, wherein a material for the first semiconductor layer is GaN;
epitaxially growing a second semiconductor layer on the first semiconductor layer and the plurality of protrusions exposed by the first semiconductor layer, wherein a material for the second semiconductor layer is a GaN-based material, the material for the second semiconductor layer is different from the material for the first semiconductor layer, and the second semiconductor layer has gaps, which penetrate through the second semiconductor layer in a thickness direction; and
introducing H 2 at a temperature higher than 300° C., wherein H 2 reacts with the first semiconductor layer via the gaps to generate a metal Ga layer only made of Ga.
2 . The method of manufacturing the GaN-based substrate according to claim 1 , wherein the material for the second semiconductor layer is AlGaN or AlN.
3 . The method of manufacturing the GaN-based substrate according to claim 1 , wherein, before the first semiconductor layer is epitaxially grown, the method further comprising:
growing a first nucleation layer on the patterned base in the same shape as the patterned base, wherein a material for the first nucleation layer is AlGaN or AlN; and the first semiconductor layer and the second semiconductor layer are epitaxially grown on the first nucleation layer.
4 . The method of manufacturing the GaN-based substrate according to claim 3 , wherein, before the first semiconductor layer is epitaxially grown, the method further comprising:
growing a second nucleation layer on the patterned base at a low temperature, wherein the second nucleation layer is located on the patterned base in the same shape as the patterned base; a material for the second nucleation layer is GaN; the first semiconductor layer is epitaxially grown on the second nucleation layer at the plurality of depressions; the second semiconductor layer is epitaxially grown upwards firstly on the first semiconductor layer, then the second semiconductor layer is laterally coalesced on the plurality of protrusions exposed by the first semiconductor layer, and thereafter, the second semiconductor layer is epitaxially grown upwards in the form of an entire surface.
5 . The method of manufacturing the GaN-based substrate according to claim 1 , wherein the patterned base is a patterned sapphire base.
6 . A method of manufacturing a GaN-based substrate, comprising:
providing a patterned base comprising a plurality of depressions and a plurality of protrusions;
epitaxially growing a first semiconductor layer in the plurality of depressions, wherein a material for the first semiconductor layer is GaN;
introducing H 2 at a temperature higher than 300° C., wherein H 2 reacts with the first semiconductor layer to generate a metal Ga layer only made of Ga; and
performing epitaxial growth on the plurality of protrusions exposed by the metal Ga layer to form a second semiconductor layer covering an entire surface of the metal Ga layer, wherein a material for the second semiconductor layer is a GaN-based material.
7 . The method of manufacturing the GaN-based substrate according to claim 6 , wherein the material for the second semiconductor layer is AlGaN or AlN.
8 . The method of manufacturing the GaN-based substrate according to claim 6 , wherein, before the first semiconductor layer is epitaxially grown, the method further comprising:
growing a first nucleation layer on the patterned base in the same shape as the patterned base, wherein a material for the first nucleation layer is AlGaN or AlN; the first semiconductor layer and the second semiconductor layer are epitaxially grown on the first nucleation layer.
9 . The method of manufacturing the GaN-based substrate according to claim 6 , wherein, before the first semiconductor layer is epitaxially grown, the method further comprising:
growing a second nucleation layer on the patterned base at a low temperature, wherein the second nucleation layer is located on the patterned base in the same shape as the patterned base; a material for the second nucleation layer is GaN; the first semiconductor layer is epitaxially grown on the second nucleation layer at the plurality of depressions;
wherein after the first semiconductor layer reacts to generate the metal Ga layer, the method further comprising:
growing a third nucleation layer on the plurality of protrusions exposed by the metal Ga layer, wherein a material for the third nucleation layer is AlGaN or AlN; and the second semiconductor layer is epitaxially grown on the third nucleation layer.
10 . The method of manufacturing the GaN-based substrate according to claim 6 , wherein the patterned base is a patterned sapphire base.