Manufacturing device of display device and manufacturing method of display device
According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate, forming an organic layer, forming an upper electrode, forming a first transparent layer, and forming a second transparent layer. In a deposition process, an evaporation source emits a material to the processing substrate and a film thickness measurement device, and the film thickness measurement device applies an acoustic impedance correction value which differs depending on a frequency of a crystal oscillator, and measures an evaporation rate based on an amount of change in the frequency of the crystal oscillator, and a controller controls the evaporation source such that the evaporation rate becomes constant.
1 . A manufacturing method of a display device, comprising:
preparing a processing substrate by forming a lower electrode above a substrate, forming a rib comprising an aperture which overlaps the lower electrode, and forming a partition including a lower portion located on the rib and an upper portion which is located on the lower portion and protrudes from a side surface of the lower portion;
forming an organic layer on the lower electrode in the aperture;
forming an upper electrode on the organic layer;
forming a first transparent layer on the upper electrode; and
forming a second transparent layer having a refractive index which is lower than a refractive index of the first transparent layer on the first transparent layer, wherein
a process of forming the organic layer, the upper electrode, the first transparent layer and the second transparent layer is a deposition process using the partition as a mask, and
in the deposition process of forming at least one of the organic layer, the upper electrode, the first transparent layer and the second transparent layer,
an evaporation source emits a material to the processing substrate and a film thickness measurement device,
the film thickness measurement device applies an acoustic impedance correction value which differs depending on a frequency of a crystal oscillator, and measures an evaporation rate based on an amount of change in the frequency of the crystal oscillator, and
a controller controls the evaporation source such that the evaporation rate becomes constant.
2 . The manufacturing method of claim 1 , wherein
the evaporation source emits an organic material for forming the second transparent layer.
3 . The manufacturing method of claim 2 , wherein
the second transparent layer is formed by depositing the organic material while conveying the processing substrate in which the first transparent layer is formed along a conveyance path on a side opposite to the film thickness measurement device across the intervening evaporation source.
4 . The manufacturing method of claim 1 , wherein
the organic layer, the upper electrode, the first transparent layer and the second transparent layer formed immediately above the upper portion of the partition are spaced apart from the organic layer, the upper electrode, the first transparent layer and the second transparent layer formed immediately above the lower electrode in the aperture.
5 . The manufacturing method of claim 4 , wherein
a sealing layer is further formed using an inorganic insulating material having a refractive index which is higher than the refractive index of the second transparent layer after the second transparent layer is formed, and
the sealing layer covers the second transparent layer located on the partition, covers the second transparent layer located immediately above the lower electrode, and is in contact with the partition.
6 . The manufacturing method of claim 5 , wherein
a patterned resist is further formed on the sealing layer after the sealing layer is formed, and
the sealing layer, the second transparent layer, the first transparent layer, the upper electrode and the organic layer exposed from the resist are removed by etching in series.
7 . A manufacturing device of a display device, comprising:
a first evaporation portion which forms an organic layer while conveying a processing substrate comprising:
a lower electrode located above a substrate;
a rib comprising an aperture which overlaps the lower electrode; and
a partition including a lower portion located on the rib and an upper portion which is located on the lower portion and protrudes from a side surface of the lower portion,
the organic layer being formed on the lower electrode in the aperture;
a second evaporation portion which forms an upper electrode on the organic layer;
a third evaporation portion which forms a first transparent layer on the upper electrode; and
a fourth evaporation portion which forms, on the first transparent layer, a second transparent layer having a refractive index which is lower than a refractive index of the first transparent layer, wherein
at least one of the first evaporation portion, the second evaporation portion, the third evaporation portion and the fourth evaporation portion comprises:
an evaporation source comprising a first nozzle which faces a conveyance path of the processing substrate and a second nozzle provided on a side opposite to the first nozzle;
a film thickness measurement device which comprises a crystal oscillator facing the second nozzle, holds a table of an acoustic impedance correction value which differs depending on a frequency of the crystal oscillator, and is configured to measure an evaporation rate based on an amount of change in the frequency of the crystal oscillator; and
a control unit which controls the evaporation source such that the evaporation rate becomes constant.
8 . The manufacturing device of claim 7 , wherein
the evaporation source is configured to emit an organic material for forming the second transparent layer.