Flexible and low cost piezoelectric composites with high D33 values
The disclosure concerns filled a polymer composite comprising a piezoelectric filler and a polymer resin. The composite may exhibit a piezoelectric coefficient d 33 of greater than 30 pC/N when measured according to the Berlincourt Method using a d33 piezometer and a density of less than 5 g/cc according to the Archimedes method.
1 . A method of forming a piezoelectric composite, the method comprising:
processing a piezoelectric filler to form a piezoelectric powder, wherein the piezoelectric powder comprises particulate having a size of from about 1 μm to about 3 μm;
combining a polymer resin comprising a ferroelectric fluoropolymer and a solvent to provide a solution;
combining the piezoelectric powder with the solution to provide a piezoelectric solution; and
forming a film from the piezoelectric solution,
wherein the processing comprises heating the piezoelectric powder to a temperature of at least 1050° C. to 1200° C.
2 . The method of claim 1 , wherein the processing comprises milling.
3 . The method of claim 1 , wherein the processing comprises heating the piezoelectric powder to a temperature of at least 1100° C.
4 . The method of claim 1 , wherein the piezoelectric filler comprises lead zirconium titanate.
5 . The method of claim 1 , wherein the polymer resin and solvent are combined in a ratio from 1:4 to 1:10.