Surface profiling and texturing of chamber components
Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component based on the measured parameter.
1 . A method, comprising:
measuring a parameter of a reference substrate using one or more sensors, wherein the measured parameter is a temperature of the reference substrate that is determined based on a measurement of at least one of a substrate film thickness, a dielectric constant, or a substrate film stress;
determining deposition film thickness non-uniformities across the reference substrate or thermal non-uniformities across the reference substrate based on the measured parameter; and
texturizing a surface of a chamber component in a non-uniform manner based on the deposition film thickness non-uniformities or the thermal non-uniformities so that the texturized surface improves film uniformity on a substrate during processing, wherein texturizing the chamber component comprises at least one of:
making some portions of the chamber component smoother and making other portions of the chamber component rougher to provide the chamber component with a surface finish having regions of different emissivity, or
changing a surface area in different regions of the surface.
2 . The method of claim 1 , wherein the one or more sensors are disposed in a process chamber and measuring the parameter comprises scanning the reference substrate as the reference substrate is transferred through the process chamber.
3 . The method of claim 1 , wherein the surface of the chamber component is texturized via laser, water jetting, bead blasting, or chemical texturing.
4 . The method of claim 1 , wherein measuring the parameter of the reference substrate and texturizing the surface of the chamber component are done in a single process chamber to improve film uniformity in the single process chamber during subsequent processing.
5 . The method of claim 1 , wherein measuring the parameter of the reference substrate and texturizing the surface of the chamber component are done in different process chambers.
6 . The method of claim 1 , further comprising applying a transfer function to the measured parameter of the reference substrate to generate a target pattern and the texturizing is based on the target pattern.
7 . The method of claim 1 , further comprising generating a thermal map based on the measured parameter and texturizing the surface of the chamber component based on the thermal map.
8 . The method of claim 1 , further comprising coating the chamber component with a protective coating after texturizing the surface of the chamber component.
9 . The method of claim 8 , wherein texturizing the surface of the chamber component and coating the chamber component are performed in a single process chamber.
10 . The method of claim 8 , wherein texturizing the surface of the chamber component and coating the chamber component is performed in different process chambers.
11 . The method of claim 1 , wherein texturizing the surface comprises a local modification to compensate for a local high or a local low deposition region on the reference substrate.
12 . The method of claim 1 , wherein texturizing the surface comprises a global modification to create a profile that compensates for a deposition profile of the reference substrate.
13 . The method of claim 1 , wherein the chamber component is aligned with respect to a texturing tool prior to being texturized based on a target pattern.
14 . The method of claim 1 , wherein measuring the parameter is of the reference substrate, and further comprising:
processing the reference substrate in a first process chamber prior to measuring the parameter, wherein texturizing the chamber component is done in a second process chamber different than the first process chamber; and
installing the chamber component in the first process chamber after texturizing the chamber component.
15 . The method of claim 1 , wherein texturizing the surface comprises reducing the surface roughness in one region of the chamber component and increasing the surface roughness in another region of the chamber component.
16 . A method, comprising:
measuring a parameter of a reference substrate using one or more sensors, wherein the measured parameter is a temperature of the reference substrate that is determined based on a measurement of at least one of a substrate film thickness, a dielectric constant, or a substrate film stress;
determining deposition film thickness non-uniformities across the reference substrate or thermal non-uniformities across the reference substrate based on the measured parameter;
texturizing a surface of a chamber component in a non-uniform manner based on the deposition film thickness non-uniformities or the thermal non-uniformities so that the texturized surface improves film uniformity on a substrate during processing, wherein texturizing the chamber component comprises at least one of:
making some portions of the chamber component smoother and making other portions of the chamber component rougher to provide the chamber component with a surface finish having regions of different emissivity, or
changing a surface area in different regions of the surface; and
applying a transfer function to the measured parameter of the reference substrate to generate a target pattern and the texturizing is based on the target pattern, wherein the transfer function is based on multiple weighted inputs of the measured parameter.
17 . A non-transitory computer readable medium for storing computer instructions that, when executed by at least one processor causes the at least one processor to perform a method comprising:
measuring a parameter of a reference substrate using one or more sensors, wherein the measured parameter is a temperature of the reference substrate that is determined based on a measurement of at least one of a substrate film thickness, a dielectric constant, or a substrate film stress;
determining deposition film thickness non-uniformities across the reference substrate or thermal non-uniformities across the reference substrate based on the measured parameter; and
texturizing a surface of a chamber component in a non-uniform manner based on the deposition film thickness non-uniformities or the thermal non-uniformities so that the texturized surface improves film uniformity on a substrate during processing, wherein texturizing the chamber component comprises at least one of:
making some portions of the chamber component smoother and making other portions of the chamber component rougher to provide the chamber component with a surface finish having regions of different emissivity, or
changing a surface area in different regions of the surface.
18 . The computer readable medium of claim 17 , wherein the one or more sensors are disposed in a process chamber and measuring the parameter comprises scanning the reference substrate as the reference substrate is transferred through the process chamber.
19 . The computer readable medium of claim 17 , wherein the surface of the chamber component is texturizing via laser, water jetting, bead blasting, or chemical texturing.
20 . The computer readable medium of claim 17 , wherein measuring the parameter of the reference substrate and texturizing the surface of the chamber component are done in a single process chamber to improve film uniformity in the single process chamber during subsequent processing.
21 . The computer readable medium of claim 17 , wherein measuring the parameter of the reference substrate and texturizing the surface of the chamber component are done in different process chambers.
22 . The computer readable medium of claim 17 , further comprising applying a transfer function to the measured parameter of the reference substrate to generate a target pattern and the texturizing is based on the target pattern.
23 . The computer readable medium of claim 17 , further comprising generating a thermal map based on the measured parameter and texturizing the surface of the chamber component based on the thermal map.
24 . The computer readable medium of claim 17 , further comprising coating the chamber component with a protective coating after texturizing the surface of the chamber component.
25 . The computer readable medium of claim 24 , wherein texturizing the surface of the chamber component and coating the chamber component are performed in a single process chamber.
26 . The computer readable medium of claim 24 , wherein texturizing the surface of the chamber component and coating the chamber component is performed in different process chambers.