Method of processing SiC wafer
A method of processing an SiC wafer includes a laser processing step of applying a laser beam to the SiC wafer along projected dicing lines established thereon to sever a metal film on the SiC wafer along the projected dicing lines and form grooves in the SiC wafer along the projected dicing lines, a tape mounting step of mounting a tape on the metal film before or after the laser processing step, and a dividing step of gripping, vertically between gripping members, an area of the SiC wafer adjacent to one at a time of the projected dicing lines along which the SiC wafer is to be divided and pressing, with a pressing member, an area of the SiC wafer adjacent to and across the one of the projected dicing lines from the gripping members, thereby dividing the SiC wafer along the one of the projected dicing lines.
1 . A method of processing a SiC wafer having a plurality of projected dicing lines established on a face side thereof and a metal film layered on a reverse side thereof, the method comprising:
a laser processing step of applying a laser beam to the SiC wafer along the projected dicing lines to sever the metal film along the projected dicing lines and form grooves in the SiC wafer along the projected dicing lines;
a tape mounting step of mounting a tape on the metal film before or after the laser processing step; and
after the laser processing step and the tape mounting step, a dividing step of gripping, vertically between gripping members, an area of the SiC wafer adjacent to one at a time of the projected dicing lines along which the SiC wafer is to be divided and pressing, with a pressing member, an area of the SiC wafer adjacent to and across the one of the projected dicing lines from the gripping members, thereby dividing the SiC wafer along the one of the projected dicing lines.
2 . The method of processing a SiC wafer according to claim 1 , wherein the tape mounting step is carried out before the laser processing step, and
the laser processing step includes a step of holding the face side of the SiC wafer on a holding table and applying the laser beam through the tape to the metal film to sever the metal film along the projected dicing lines and form laser-processed grooves in the SiC wafer along the projected dicing lines.
3 . The method of processing a SiC wafer according to claim 1 , wherein the laser beam applied to the SiC wafer in the laser processing step has an elliptical focused spot on the metal film, and the laser processing step includes a step of orienting a major axis of the elliptical focused spot in a direction along which the projected dicing line extends.