Cover assembly of semiconductor manufacturing tool

1 . A cover assembly for covering a process chamber cap of a semiconductor manufacturing tool, comprising:

a cover body having a sidewall substantially surrounding the process chamber cap;

a first gas intake apparatus disposed on the sidewall of the cover body and configured to provide a gas into an inner space of the cover body; and

a gas outlet disposed at an upper of the cover body and configured to expel the gas from the inner space of the cover body,

wherein the first gas intake apparatus is configured to direct the gas to flow in a first direction into the inner space of the cover body; and wherein, from a top view perspective, the first direction is angularly offset relative to a first line connecting a center of the first gas intake apparatus with a center of an upper portion of the cover body;

wherein the first gas intake apparatus comprises a fan device configured to provide a flow of the gas and a deflector configured to deflect the flow of the gas from the fan device.

2 . The cover assembly of claim 1 , wherein the first gas intake apparatus is configured to direct the gas to flow substantially along the sidewall of the cover body.

3 . The cover assembly of claim 1 , wherein the deflector comprises a plurality of blades, and wherein the plurality of blades is configured to deflect the flow of the gas when the gas passes through the deflector.

4 . The cover assembly of claim 1 , further comprising a second gas intake apparatus disposed on the sidewall of the cover body and configured to provide the gas into the inner space of the cover body, wherein the second gas intake apparatus is configured to direct the gas to flow in a second direction into the inner space of the cover body; and wherein, from the top view perspective, the second direction is angularly offset relative to a second line connecting a center of the second gas intake apparatus with the center of the upper portion of the cover body.

5 . The cover assembly of claim 4 , wherein the second gas intake apparatus is configured to direct the gas to substantially flow towards the first gas intake apparatus.

6 . The cover assembly of claim 4 , wherein, from the top view perspective, wherein an angle between the first line and the second line ranges between 80 degrees to 100 degrees.

7 . The cover assembly of claim 6 , wherein, from the top view perspective, an angle between the first line and a third line connecting the gas outlet with the center of the upper of the cover body ranges between 125 degrees to 145 degrees, and an angle between the second line and the third line ranges between 125 degrees to 145 degrees.

8 . A cover assembly for covering a process chamber cap of a semiconductor manufacturing tool, comprising:

a cover body having a sidewall substantially surrounding the process chamber cap;

a first gas intake apparatus disposed on the sidewall of the cover body and configured to provide a gas into an inner space of the cover body; and

a gas outlet disposed at an upper of the cover body and configured to expel the gas from the inner space of the cover body,

wherein the first gas intake apparatus comprises:

a first deflector; and

a first fan device configured to provide the gas to pass through the first deflector,

wherein the first fan device is configured to direct the gas to flow in a first direction towards the first deflector; wherein the first deflector is configured to direct the gas from the first fan device to flow in a second direction into the interior space of the cover body; and wherein the first direction is different from the second direction.

9 . The cover assembly of claim 8 , wherein the first deflector comprises a plurality of first blades, and wherein each of the first blades is positioned at an angle relative to the first direction.

10 . The cover assembly of claim 9 , wherein each of the first blades extends substantially vertically when the first deflector is disposed on the sidewall of the cover body.

11 . The cover assembly of claim 9 , wherein a number of the plurality of first blades is in a range of approximately 4 to 9.

12 . The cover assembly of claim 11 , wherein the angle of each of the first blades is approximately within a range of 42 degrees to 69 degrees.

13 . The cover assembly of claim 12 , wherein each of the first blades has a width of about 13 mm to 28 mm.

14 . The cover assembly of claim 13 , wherein each of the first blades has a thickness of about 1.5 mm to 7.5 mm.

15 . The cover assembly of claim 14 , wherein the first deflector comprises a ring-shaped body and the plurality of first blades are disposed at the ring-shaped body, and wherein the ring-shaped body has a diameter of about 146 mm to 173 mm and a thickness of about 5 mm to 11 mm.

16 . The cover assembly of claim 15 , wherein the first fan device comprises a main body which is configured to match the ring-shaped body of the first deflector, and wherein the main body of the first fan device has a diameter of about 146 mm to 173 mm and a thickness of about 37 mm to 52 mm.

17 . The cover assembly of claim 16 , wherein a ratio of a diameter of the first gas intake apparatus to a thickness of the first gas intake apparatus is approximately between 2.3 and 4.

18 . A cover assembly for covering a process chamber cap of a semiconductor manufacturing tool, comprising:

a cover body having a sidewall substantially surrounding the process chamber cap;

a gas intake apparatus disposed on the sidewall of the cover body and configured to provide a gas to flow into an inner space of the cover body; and

a gas outlet disposed at an upper of the cover body and configured to expel the gas from the inner space of the cover body,

wherein the gas intake apparatus is arranged such that the gas flowing into the inner space of the cover body flows in a direction angularly offset relative to a line connecting a center of the gas intake apparatus with a center of the process chamber cap.

19 . The cover assembly of claim 18 , wherein, from a top view perspective, a direction in which the gas flows into the inner space of the cover body forms an angle of approximately 42 degrees to 69 degrees with a line connecting a center of the process chamber cap to a center of the gas intake apparatus.

20 . The cover assembly of claim 18 , wherein the gas intake apparatus is configured to direct the gas to flow substantially along an inner surface of the sidewall of the cover body.