Systems and methods for semiconductor wafer transport

1 . A device, comprising:

a movable blade configured to receive a semiconductor wafer;

a positional sensor configured to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body; and

a plurality of temperature sensors to determine a temperature of a plurality of zones of the semiconductor wafer, the plurality of zones being concentrically spaced from one another;

wherein the movable blade is further configured to move with respect to the stationary body to cause a displacement of the semiconductor wafer relative to the movable blade; and

wherein the positional sensor is physically coupled to the movable blade.

2 . The device of claim 1 , wherein:

the device comprises a vacuum interface to adhere the semiconductor wafer to the movable blade;

a vacuum of the vacuum interface is selectively disengageable; and

the vacuum interface is configured to disengage the vacuum interface prior to the displacement of the semiconductor wafer relative to the movable blade, and thereupon engage the vacuum interface prior to a coupled movement of the semiconductor wafer and the movable blade.

3 . The device of claim 2 , wherein the positional sensor comprises:

a first sensor to detect a portion of a front opening unified pod (FOUP);

a second sensor to detect a gap between the semiconductor wafer and an additional semiconductor wafer; and

a third sensor to detect a position of the FOUP in a direction perpendicular to the first sensor.

4 . The device of claim 1 , further comprising:

a contact sensor coupled to the movable blade to determine a temperature of the semiconductor wafer adhered thereto.

5 . The device of claim 1 , further comprising:

a non-contact sensor coupled to the movable blade to determine a temperature of the semiconductor wafer adhered thereto.

6 . The device of claim 1 , wherein:

the positional sensor is one of a plurality of positional sensors configured to detect an edge of the semiconductor wafer, wherein the plurality of positional sensors are irregularly spaced about a perimeter of the wafer.

7 . The device of claim 1 , wherein the plurality of temperature sensors are configured to:

collect temperature data for:

the semiconductor wafer adhered to the movable blade; or

a temperature controlled chamber associated with the semiconductor wafer;

a memory device to store the temperature data; and

one or more processors, configured to:

compare the temperature data to a threshold to determine whether the temperature data is within a temperature range; and

adjust a temperature of the temperature controlled chamber, based on the determination of whether the temperature data is within the temperature range.

8 . The device of claim 7 , wherein the device comprises:

a machine learning model to ingest:

the temperature data for a plurality of semiconductor wafers; and

yield data for the plurality of semiconductor wafers; and

the machine learning model to determine an association between the temperature data and the yield data for the plurality of semiconductor wafers, wherein

the threshold is adjusted, based on the determined association.

9 . The device of claim 1 , wherein:

the positional sensor comprises an image sensor, coupled to the movable blade, to generate positional image data for:

the semiconductor wafer adhered to the movable blade; or

a chamber associated with the semiconductor wafer;

a memory device to store the positional image data; and

one or more processors, configured to:

compare the positional image data to a threshold to determine whether the position of the semiconductor wafer is within a position range; and

adjust the position of the semiconductor wafer, based on the determination of whether the position of the semiconductor wafer is within the position range.

10 . The device of claim 9 , further comprising:

a machine learning model to ingest:

the positional image data for a plurality of semiconductor wafers; and

yield data for the plurality of semiconductor wafers;

wherein the machine learning model is configured to determine an association between the positional image data and the yield data for the plurality of semiconductor wafers; and

wherein the threshold is adjusted, based on the determined association.

11 . An assembly, comprising:

a movable blade;

a vacuum interface to adhere a semiconductor wafer to the movable blade;

a positional sensor configured to detect a lateral position of the semiconductor wafer relative to a surface of the movable blade; and

a plurality of temperature sensors to determine temperatures of a plurality of zones of the semiconductor wafer.

12 . The assembly of claim 11 , further comprising a controller to:

adjust a position of the movable blade based on the lateral position of the semiconductor wafer.

13 . The assembly of claim 11 , further comprising a controller to:

adjust a chamber temperature based on the temperatures of the plurality of zones.

14 . The assembly of claim 11 , wherein the positional sensor comprises:

a first sensor to detect a portion of a front opening unified pod (FOUP);

a second sensor to detect a gap between the semiconductor wafer and an additional semiconductor wafer; and

a third sensor to detect a position of the FOUP in a direction perpendicular to the first sensor.