Bonding apparatus, bonding method, estimation method, and article manufacturing method
The present invention provides a bonding apparatus for bonding, to a first member including a first bonding surface on which a first pattern is provided, a second member including a second bonding surface on which a second pattern is provided, comprising: a first image capturing device configured to capture an image of the first bonding surface; a second image capturing device configured to capture an image of the second bonding surface; and a controller configured to control a bonding process of aligning the first member and the second member based on a position of the first pattern obtained from the captured image by the first image capturing device and a position of the second pattern obtained from the captured image by the second image capturing device, and bonding the second member to the first member.
1 . A bonding apparatus for bonding a second member including a second pattern to a first member including a first pattern, comprising:
a first image capturing device; and
a controller configured to control a bonding process of bonding the second member to the first member,
wherein the controller is configured to determine a relative position between the first pattern and the second pattern after the bonding process,
based on feature position information and positional relationship information,
wherein the first pattern is different from a first alignment mark formed on the first member and the second pattern is different from a second alignment mark formed on the second member, the first alignment mark and the second alignment mark being used to align the first member and the second member before the bonding process,
wherein the feature position information represents a position of a feature portion of the second member with respect to the first member, and is obtained based on an image of the second member bonded to the first member by the bonding process, the image being captured by the first image capturing device, and
wherein the positional relationship information represents a positional relationship between the feature portion and the second pattern.
2 . The apparatus according to claim 1 , further comprising a second image capturing device configured to capture an image of the second alignment mark provided on the second member,
wherein the first image capturing device is configured to capture an image of the first alignment mark provided on the first member, and
wherein the controller is configured to:
obtain information regarding a relative position between the first member and the second member based on a position of the first alignment mark in the image captured by the first image capturing device and a position of the second alignment mark in the image captured by the second image capturing device; and
control a process of aligning the first member and the second member based on the obtained information regarding the relative position between the first member and the second member, and bonding the second member to the first member.
3 . The apparatus according to claim 2 , wherein the information regarding the relative position between the first member and the second member includes information regarding a relative position between the first pattern and the second pattern.
4 . The apparatus according to claim 2 , further comprising:
a first holder configured to hold the first member; and
a second holder configured to hold the second member,
wherein the controller is configured to control the bonding process by relatively driving the first holder and the second holder.
5 . The apparatus according to claim 4 , wherein
the first image capturing device is arranged to capture an image of a first bonding surface which is a bonding surface of the first member, in a state in which the first member is held by the first holder, and
the second image capturing device is arranged to capture an image of a second bonding surface which is a bonding surface of the second member, in a state in which the second member is held by the second holder.
6 . The apparatus according to claim 1 , wherein the feature portion of the second member is an index that can be confirmed in both an image obtained by capturing a second bonding surface which is a bonding surface of the second member and an image obtained by capturing a surface opposite to the second bonding surface.
7 . The apparatus according to claim 1 , wherein the feature portion of the second member is an outer edge of the second member.
8 . The apparatus according to claim 1 , wherein the feature portion of the second member is a through hole extending from a second bonding surface which is a bonding surface of the second member to a surface opposite to the second bonding surface.
9 . The apparatus according to claim 2 , wherein the controller is configured to obtain the feature position information based on images obtained by the second image capturing device before the bonding process.
10 . The apparatus according to claim 1 , wherein the controller is configured to determine the relative position between the first pattern and second pattern by converting the position of the feature portion of the second member in the feature position information into a position of the second pattern based on the positional relationship information.
11 . The apparatus according to claim 1 , wherein the controller is configured to output information representing the relative position between the first pattern and second pattern obtained based on the positional relationship information and the feature position information.
12 . The apparatus according to claim 1 , wherein the controller is configured to output an evaluation result of the relative position between the first pattern and second pattern obtained based on the positional relationship information and the feature position information.
13 . The apparatus according to claim 1 , wherein the controller is configured to execute a separation process of separating the second member from the first member, in accordance with an evaluation result of the relative position between the first pattern and second pattern obtained based on the positional relationship information and the feature position information.
14 . The apparatus according to claim 1 , further comprising a second image capturing device,
wherein the positional relationship information is obtained based on an image of a second bonding surface including the second pattern before the bonding process, the image being captured by the second image capturing device.
15 . A bonding method of bonding a second member including a second pattern to a first member including a first pattern, comprising:
bonding the second member to the first member;
determining, after the bonding process, a relative position between the first pattern and the second pattern based on feature position information and positional relationship information,
wherein the first pattern is different from a first alignment mark formed on the first member and the second pattern is different from a second alignment mark formed on the second member, the first alignment mark and the second alignment mark being used to align the first member and the second member before the bonding process,
wherein the feature position information represents a position of a feature portion of the second member with respect to the first member, and is obtained based on an image of the second member bonded to the first member, and
wherein the positional relationship information represents a positional relationship between the feature portion and the second pattern.
16 . A method of manufacturing an article, comprising:
bonding a second member to a first member using a bonding method defined in claim 15 ;
processing the first member to which the second member has been bonded; and
manufacturing an article from the processed first member.