Cold plate cooling for wafer-scale integration with back side modular power delivery
Techniques for cooling are disclosed. A wafer-scale silicon interposer (WSSI) is accessed. A front side of the WSSI is bonded to a plurality of functional chips. The chips create heat during operation. The WSSI includes a plurality of through-silicon vias (TSVs). A back side of the WSSI is coupled to a plurality of DC-to-DC power converters. A cold plate is attached to the chips. The cold plate comprises an inlet plate, a jet-plate, and a fin-plate. A coolant at a first temperature is sent into at least one inlet plate inlet nozzle. The sending includes spraying the coolant on the fin-plate. At least a portion of the heat that was created, by the cold plate, is transferred to the coolant. The coolant is captured, at a second temperature, from one or more outlet chambers within the jet-plate.
1 . A method for cooling comprising:
accessing a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the plurality of functional chips creates heat during operation, wherein the WSSI includes a plurality of through-silicon vias (TSVs), wherein a back side of the WSSI is coupled to a plurality of DC-to-DC power converters;
attaching a cold plate to the plurality of functional chips, wherein the cold plate comprises an inlet plate, a jet-plate, and a fin-plate;
sending a coolant at a first temperature into at least one inlet nozzle located on the inlet plate, wherein the sending includes spraying the coolant, by the jet-plate, on the fin-plate;
transferring at least a portion of the heat that was created, by the cold plate, to the coolant that was sent; and
capturing the coolant, at a second temperature, from one or more outlet chambers within the jet-plate.
2 . The method of claim 1 wherein the inlet nozzle within the inlet plate is orthogonal to a heat extraction plane within the fin-plate.
3 . The method of claim 1 wherein the spraying occurs at a location on the fin-plate corresponding to each functional chip within the plurality of functional chips.
4 . The method of claim 1 wherein the fin-plate comprises a plurality of internal fins.
5 . The method of claim 4 wherein the plurality of internal fins includes one or more structural pillars.
6 . The method of claim 5 wherein the structural pillars provide rigidity between the jet-plate and the fin-plate, wherein the structural pillars include mechanical connections between the jet-plate and the fin-plate.
7 . The method of claim 5 wherein the one or more structural pillars are comprised of copper.
8 . The method of claim 4 wherein the jet-plate and the fin-plate are mechanically connected.
9 . The method of claim 8 wherein a height of each internal fin within the plurality of internal fins provides a gap to a top of the jet-plate from a bottom of the fin-plate.
10 . The method of claim 1 further comprising attaching, to the back side of the WSSI, a plurality of modular power substrates (MPSs), wherein each MPS is coupled to a corresponding functional chip within the plurality of functional chips.
11 . The method of claim 10 wherein the plurality of MPSs is based on a form factor mirroring the corresponding functional chip.
12 . The method of claim 10 further comprising connecting mechanically the plurality of MPSs, to a unified control board (UCB), wherein the UCB includes the plurality of DC-to-DC power converters.
13 . The method of claim 12 further comprising delivering DC power, by the UCB, to the plurality of MPSs, wherein the delivering includes a first voltage conversion.
14 . The method of claim 13 further comprising transferring the DC power that was delivered, by the plurality of MPSs, to the plurality of functional chips, wherein the transferring includes a second voltage conversion, and wherein the transferring is based on the plurality of TSVs.
15 . The method of claim 1 wherein the attaching includes a thermal interface material (TIM).
16 . The method of claim 1 wherein the inlet plate, the jet-plate, and the fin-plate are comprised of copper.
17 . The method of claim 1 wherein the plurality of functional chips includes one or more artificial intelligence accelerators.
18 . The method of claim 1 wherein the plurality of functional chips includes one or more memory devices.
19 . The method of claim 1 further comprising mounting the cold plate to an isometric grid array (IGA), wherein the IGA provides stiffening for the WSSI.
20 . The method of claim 19 wherein the mounting is based on one or more spring-loaded fasteners.
21 . An apparatus for cooling comprising:
a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the plurality of functional chips creates heat during operation, and wherein the WSSI includes a plurality of through-silicon vias (TSVs), wherein a back side of the WSSI is coupled to a plurality of DC-to-DC power converters;
a cold plate, wherein the cold plate comprises an inlet plate, a jet-plate, and a fin-plate;
at least one inlet nozzle located on the inlet plate, wherein the inlet nozzle receives a coolant at a first temperature, and wherein the jet-plate is used to spray the coolant that was received on the fin-plate, and wherein at least a portion of the heat that was created is transferred, by the cold plate, to the coolant that was sent; and
one or more outlet chambers within the jet-plate, wherein the one or more outlet chambers capture the coolant at a second temperature.
22 . The apparatus of claim 21 wherein the inlet plate includes at least one inlet nozzle, wherein the inlet nozzle receives the coolant at the first temperature.
23 . The apparatus of claim 22 wherein the at least one inlet nozzle is located orthogonally to a heat extraction plane within the fin-plate.
24 . The apparatus of claim 21 wherein the jet-plate is used to spray the coolant on the fin-plate.
25 . The apparatus of claim 24 wherein the fin-plate comprises a plurality of internal fins.
26 . The apparatus of claim 25 wherein the plurality of internal fins includes one or more structural pillars.
27 . The apparatus of claim 21 wherein the jet-plate includes one or more outlet chambers, wherein the one or more outlet chambers capture the coolant at the second temperature.
28 . The apparatus of claim 21 further comprising a plurality of modular power substrates (MPSs), wherein the plurality of MPSs is attached to a back side of the WSSI.
29 . The apparatus of claim 21 further comprising a unified circuit board (UCB), wherein the UCB is mechanically connected to a plurality of modular power substrates (MPSs), wherein the UCB includes a plurality of DC-to-DC converters, and wherein the UCB sends DC power to the plurality of functional chips bonded to the WSSI, wherein the sending is based on the plurality of TSVs.
30 . A system for cooling comprising:
a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the plurality of functional chips create heat during operation, wherein the WSSI includes a plurality of through-silicon vias (TSVs), and wherein a back side of the WSSI is coupled to a plurality of DC-to-DC power converters;
a cold plate, wherein the cold plate comprises an inlet plate, a jet-plate, and a fin-plate, wherein the inlet plate includes at least one inlet nozzle, wherein the jet-plate includes one or more outlet chambers, wherein the system, when supplied with a coolant at a first temperature, is configured to:
send the coolant at a first temperature into the at least one inlet nozzle located on the inlet plate;
spray the coolant, by the jet-plate, on the fin-plate;
transfer at least a portion of the heat that was created, by the cold plate, to the coolant that was sent; and
capture the coolant, at a second temperature, from the one or more outlet chambers within the jet-plate.