Power module packaging structure

1 . A power module, comprising:

a first conductive plate having a first side and a second side opposite to the first side;

a first power component disposed at the first side;

a second power component disposed at the second side, wherein the first power component has a first geometric center and the second power component has a second geometric center; and

a plurality of conductive plates having a plurality of end portions each having a keyhole, the first conductive plate included in the plurality of conductive plates,

wherein a projection of an end of the first power component is aligned with the second geometric center of the second power component from the cross-section view,

wherein the plurality of end portions are at different elevations, and

wherein the end portions are non-overlapping with each other from a top view.

2 . The power module of claim 1 , further comprising:

a second conductive plate included in the plurality of conductive plates and disposed below the second power component; and

a first heat dissipation structure disposed on the second conductive plate, wherein the second conductive plate is configured to transfer a heat from the second power component to the first heat dissipation structure.

3 . The power module of claim 1 , further comprising:

a first spacer disposed on the first power component and electrically connecting the first power component to a third conductive plate included in the plurality of conductive plates and disposed above the first power component, wherein an area of a projection of the first spacer falls within an area of a projection of the first power component from a top view.

4 . The power module of claim 3 , further comprising a second spacer disposed on and electrically connected to the second power component, wherein the first spacer and the second spacer are non-overlapping from the top view.

5 . The power module of claim 4 , wherein the first power component comprises a first transistor and the second power component comprises a second transistor, and wherein the first spacer is electrically connected to a source terminal of the first transistor and the second spacer is electrically connected to a source terminal of the second transistor.

6 . The power module of claim 4 , wherein a projecting area of the second power component and a projecting area of the first power component overlap with an area from the top view, wherein a dislocation of the first spacer and the second spacer prevents a heat generated by the first power components and the second power component from being accumulated.

7 . A power module, comprising:

a first conductive plate comprising a first part and a second part spaced apart from the first part, wherein the first part of the first conductive plate comprises a first side and a second side opposite to the first side;

a first power component disposed on the first part and at the first side of the first conductive plate and electrically connecting to the second part of the first conductive plate through a conductive bond wiring;

a second power component disposed at the second side, wherein the first power component has a first geometric center and the second power component has a second geometric center; and

a plurality of conductive plates having a plurality of end portions each having a keyhole, the first conductive plate included in the plurality of conductive plates,

wherein a projection of an end of the first power component is aligned with the second geometric center of the second power component from the cross-section view.

8 . The power module of claim 7 , wherein the plurality of end portions are at different elevations.

9 . The power module of claim 8 , wherein the end portions are non-overlapping with each other along a direction perpendicular to the first side of the first conductive plate.

10 . The power module of claim 7 , further comprising:

a first spacer disposed on the first power component and electrically connecting the first power component to a third conductive plate included in the plurality of conductive plates and disposed above the first power component, wherein an area of a projection of the first spacer falls within an area of a projection of the first power component from a top view.

11 . The power module of claim 10 , further comprising a second spacer disposed on and electrically connected to the second power component, wherein the first spacer and the second spacer are non-overlapping from the top view, and wherein the first power component comprises a first transistor and the second power component comprises a second transistor, and wherein the first spacer is electrically connected to a source terminal of the first transistor and the second spacer is electrically connected to a source terminal of the second transistor.

12 . The power module of claim 11 , wherein a projecting area of the second power component and a projecting area of the first power component overlap with an area from the top view, wherein a dislocation of the first spacer and the second spacer prevents a heat generated by the first power components and the second power component from being accumulated.

13 . A power module, comprising:

a first power component;

a second power component disposed below the first power component;

a first conductive plate disposed between the first power component and the second power component and defining an opening through the first conductive plate, wherein the first conductive plate has a first side and a second side opposite to the first side; and

a protective layer encapsulating the first power component and second power component and partially disposed within the opening, wherein the first power component has a first geometric center and the second power component has a second geometric center; and

a plurality of conductive plates having a plurality of end portions each having a keyhole, the first conductive plate included in the plurality of conductive plates,

wherein a projection of an end of the first power component is aligned with the second geometric center of the second power component from the cross-section view,

wherein the end portions are at different levels with respect to a bottom surface of the protective layer, and

wherein the end portions are non-overlapping with each other from a top view.

14 . The power module of claim 13 , further comprising:

a first spacer disposed on the first power component and electrically connecting the first power component to a third conductive plate included in the plurality of conductive plates and disposed above the first power component, wherein an area of a projection of the first spacer falls within an area of a projection of the first power component from a top view.

15 . The power module of claim 14 , further comprising a second spacer disposed on and electrically connected to the second power component, wherein, from the top view, the first spacer is closer to the opening than the second spacer is in a first direction and a second direction perpendicular to the first direction.

16 . The power module of claim 13 , wherein a portion of the protective layer disposed within the opening has a crossed shape.