Semiconductor device module and method for manufacturing same
A semiconductor device module includes a device mounted on the surface of an organic substrate; a heat dissipation block bonded and fixed to the surfaces of the device; and a molded resin sealing the device with at least one surface of the heat dissipation block being exposed. The heat dissipation block includes a first portion and a second portion made of materials different in hardness: the first portion is harder than the second portion, and a gradient in hardness from the first portion on the side exposed from the molded resin to the second portion on the side bonded to the device, to keep a good grinding performance of grinding wheel.
1 . A semiconductor device module comprising:
a device mounted on a surface of a substrate;
a heat dissipation block formed on a surface of the device; and
a molded resin sealing the device with at least one surface of the heat dissipation block being exposed,
wherein the heat dissipation block includes portions including a first portion and a second portion, the first portion being made of a first material, the second portion being made of a second material, and the first material being harder than the second material,
the at least one surface is flush with the molded resin and includes the first portion exposed from the molded resin, and
the heat dissipation block has a gradient in hardness from the first portion on a side exposed from the molded resin to the second portion on a side in contact with the device such that the hardness gradually changes across the gradient.
2 . A method of manufacturing a semiconductor device module, comprising:
a step of mounting a device on a surface of a substrate;
a step of fixing a heat dissipation block to a surface of the device;
a step of sealing the device in a molded resin; and
a step of grinding the molded resin until at least one surface of the heat dissipation block is disposed,
wherein the heat dissipation block includes portions including a first portion and a second portion, the first portion being made of a first material, the second portion being made of a second material, and the first material being harder than the second material,
the at least one surface is flush with the molded resin and includes the first portion exposed from the molded resin, and
the heat dissipation block has a gradient in hardness from the first portion on a side exposed from the molded resin to the second portion on a side in contact with the device such that the hardness gradually changes across the gradient.
3 . The method of manufacturing the semiconductor device module of claim 2 , wherein the second portion is fixed to the surface of the device and the first portion is plated on side surfaces and a top surface of the second portion, and wherein the first portion plated at the top surface of the heat dissipation block is removed in the grinding step.
4 . The method of manufacturing the semiconductor device module of claim 2 , wherein the second portion is formed on the surface of the device and the first portion is formed on a top end of the second portion, and wherein the first portion at a top of the heat dissipation block is removed in the grinding step.