Reinforcement structure and electronic device
This application relates to the field of chip technologies, and provides a reinforcement structure and an electronic device. The reinforcement structure includes a support frame, an accommodation chamber, and an electromagnetic radiation suppression structure. The accommodation chamber is provided on the support frame and runs through a first surface and a second surface of the support frame that are opposite to each other. The accommodation chamber is used for accommodating a chip package structure disposed on a printed circuit board. A wall surface that is of the support frame and that defines the accommodation chamber is an inner surface, and a wall surface of the support frame opposite to the inner surface is an outer surface. The electromagnetic radiation suppression structure is disposed on at least one of the first surface, the second surface, the inner surface, and the outer surface.
1 . A reinforcement structure, comprising:
a support frame;
an accommodation chamber, defined by the support frame and extending through a first surface of the support frame and a second surface of the support frame that are opposite to each other, wherein the accommodation chamber is configured to accommodate a chip package structure disposed on a printed circuit board, wherein a wall surface of the support frame that faces the accommodation chamber is an inner surface, and a wall surface of the support frame opposite to the inner surface is an outer surface; and
an electromagnetic radiation suppression structure disposed on the first surface, the second surface, the inner surface, or the outer surface, wherein a concave cavity is disposed in a partial area of the first surface, the concave cavity is disposed between the accommodation chamber and the inner surface of the support frame that faces the accommodation chamber, the electromagnetic radiation suppression structure is arranged in the concave cavity abutting the inner surface of the support frame that faces the accommodation chamber, and the electromagnetic radiation suppression structure in the concave cavity protrudes from the first surface.
2 . The reinforcement structure according to claim 1 , wherein the support frame is made of a metal material.
3 . The reinforcement structure according to claim 1 , wherein the electromagnetic radiation suppression structure comprises a shield layer made of an electromagnetic shielding material.
4 . The reinforcement structure according to claim 1 , wherein the electromagnetic radiation suppression structure comprises a wave-absorbing layer made of an electromagnetic wave-absorbing material.
5 . The reinforcement structure according to claim 4 , wherein
the wave-absorbing layer is adhered to the support frame by a bonding layer; or
the electromagnetic wave-absorbing material is directly disposed on the support frame to form the wave-absorbing layer.
6 . The reinforcement structure according to claim 1 , wherein a solid insulation layer is disposed on an area of the first surface of the support frame that is not part of the concave cavity, wherein the electromagnetic radiation suppression structure in the concave cavity abuts a side surface of the solid insulation layer that faces the accommodation chamber.
7 . The reinforcement structure according to claim 1 , wherein the electromagnetic radiation suppression structure in the concave cavity extends lower than the support frame.
8 . An electronic device, comprising:
a printed circuit board;
a chip package structure on the printed circuit board;
a reinforcement structure comprising
a support frame;
an accommodation chamber, defined by the support frame and extending through a first surface of the support frame and a second surface of the support frame that are opposite to each other, wherein the accommodation chamber is configured to accommodate the chip package structure, wherein a wall surface of the support frame that defines faces the accommodation chamber is an inner surface, and a wall surface of the support frame opposite to the inner surface is an outer surface; and
an electromagnetic radiation suppression structure disposed on the first surface, the second surface, the inner surface, or the outer surface, wherein the chip package structure and the reinforcement structure are disposed on a same surface of the printed circuit board, wherein a concave cavity is disposed in a partial area of the first surface, the concave cavity is disposed between the accommodation chamber and the inner surface of the support frame that faces the accommodation chamber, the electromagnetic radiation suppression structure is arranged in the concave cavity abutting the inner surface of the support frame that faces the accommodation chamber, and the electromagnetic radiation suppression structure in the concave cavity protrudes from the first surface; and
a heat sink covering a side of the chip package structure opposite to the printed circuit board.
9 . The electronic device according to claim 8 , wherein the first surface faces the printed circuit board and a solid insulation layer is disposed between the printed circuit board and an area of the first surface that is not part of the concave cavity.
10 . The electronic device according to claim 8 , wherein the support frame comprises a plurality of support subframes, the plurality of support subframes are arranged at intervals along a periphery of the chip package structure, and a spacing between two adjacent support subframes is a quarter of a wavelength corresponding to a frequency of an electromagnetic wave to be suppressed.
11 . The electronic device according to claim 8 , wherein a surface of the reinforcement structure facing the printed circuit board abuts against the printed circuit board, and a surface of the reinforcement structure facing the heat sink abuts against the heat sink, so that the chip package structure is located in a closed cavity defined by the reinforcement structure, the heat sink, and the printed circuit board.
12 . The electronic device of claim 9 , wherein the electromagnetic radiation suppression structure in the concave cavity abuts a side surface of the solid insulation layer that faces the accommodation chamber.
13 . The electronic device of claim 9 , wherein the solid insulation layer insulates the support frame from a metal wiring on a surface of the printed circuit board.
14 . A reinforcement structure, comprising:
a support frame configured to be attached to a printed circuit board;
an accommodation chamber, defined by the support frame and extending through the support frame, wherein the accommodation chamber is configured to accommodate a chip package structure attached to the printed circuit board; and
an electromagnetic radiation suppression structure, wherein a concave cavity is disposed in a partial area of a bottom surface of the support frame, the concave cavity is disposed between the accommodation chamber and a side surface of the support frame that faces the accommodation chamber, a first portion of the electromagnetic radiation suppression structure is arranged in the concave cavity abutting the side surface of the support frame that faces the accommodation chamber, and wherein the electromagnetic radiation suppression structure comprises a shield layer made of an electromagnetic shielding material or a wave-absorbing layer made of an electromagnetic wave-absorbing material.
15 . The reinforcement structure of claim 14 , wherein a second portion of the electromagnetic radiation suppression structure is disposed on a top surface of the support frame when the support frame is attached to the printed circuit board.
16 . The reinforcement structure of claim 14 , wherein the electromagnetic radiation suppression structure is disposed on the bottom surface of the support frame when the support frame is attached to the printed circuit board.
17 . The reinforcement structure of claim 15 , wherein the second portion of the electromagnetic radiation suppression structure has a same width as the support frame in a cross-sectional view.
18 . The reinforcement structure of claim 14 , wherein a solid insulation layer is disposed on an area of the bottom surface of the support frame that is not part of the concave cavity, and wherein the concave cavity is disposed between the solid insulation layer and the chip package structure when the support frame is attached to the printed circuit board.
19 . The reinforcement structure of claim 18 , wherein the first portion of the electromagnetic radiation suppression structure abuts against the solid insulation layer.