Fan-out packaging structure and manufacturing method thereof

1 . A fan-out packaging structure, comprising a redistribution layer and at least one chip or chip-bearing package disposed on a first face of the redistribution layer, wherein:

the redistribution layer comprises a grounding line layer;

the fan-out packaging structure further comprises at least one plastic packaging layer, at least one first shielding layer and at least one electrical connector, the electrical connector being disposed on the first face of the redistribution layer, located on an outside of the chip or chip-bearing package, and electrically connected to the grounding line layer;

the plastic packaging layer is disposed at least on the first face of the redistribution layer to encapsulate the electrical connector and the chip or chip-bearing package;

the first shielding layer at least partially covers a side surface of the plastic packaging layer; and

the electrical connector is at least partially exposed to the side surface of the plastic packaging layer and electrically connected to the first shielding layer, and the first shielding layer and the grounding line layer are electrically conductive to each other by means of the electrical connector;

the electrical connector comprises a body member, and the body member is made of an organic polymer resin with an inorganic filler, or an organic polymer resin with a glass fiber cloth and a filler sheet;

a first through-hole penetrating through upper and lower surfaces of the body member is disposed in a side of the body member facing a sidewall of the first shielding layer adjacent to the body member; and

the first through-hole is filled with a conductive filler, a bottom of the body member is cladded with the conductive filler and is electrically connected to the grounding line layer, and side faces of the conductive filler are exposed from the plastic packaging layer and electrically connected to the first shielding layer, the conductive filler is a conductive adhesive comprising silver and/or copper, or a metal solder, a first metal layer or first metal layers is/are disposed on one or more of the upper and lower surfaces of the body member and a sidewall face of the first through-hole.

2 . The fan-out packaging structure according to claim 1 , wherein the redistribution layer comprises a patterned metal line layer and a patterned dielectric layer, and the metal line layer at least partially forms the grounding line layer.

3 . The fan-out packaging structure according to claim 2 , wherein the metal line layer has a thickness of less than 10 μm and a minimum line spacing of less than 15 μm, a first electrical contact block is disposed on a second face opposite to the first face of the redistribution layer, and the first electrical contact block is electrically connected to the metal line layer, the dielectric layer is made of one or a combination of an organic polymer resin, an organic polymer resin with an inorganic filler, an organic polymer resin with a glass fiber cloth and a filler sheet, and polyimide, and the metal line layer is made of one or a combination of copper, titanium, and titanium tungsten.

4 . The fan-out packaging structure according to claim 1 , wherein a second shielding layer is further disposed between the first shielding layer and the plastic packaging layer, the second shielding layer being a single-layer shielding layer or a multi-layer composite shielding layer, and the second shielding layer having a different shielding coefficient from that of the first shielding layer in at least a portion of frequency range.

5 . The fan-out packaging structure according to claim 4 , wherein the second shielding layer is internally provided with a plurality of shielding-layer grooves or shielding-layer through-holes, the first shielding layer is filled in the shielding-layer grooves or the shielding-layer through-holes, or the first shielding layer is plated on inner wall faces of the shielding-layer grooves or the shielding-layer through-holes.

6 . The fan-out packaging structure according to claim 1 , wherein the electrical connector is located at each of four corners and/or on each of four edges of the redistribution layer and is distributed in a substantially symmetrical manner with respect to a center of the redistribution layer.

7 . A manufacturing method of a fan-out packaging structure according to claim 1 , comprising the steps of:

providing a carrier board, fabricating a patterned metal line layer and a patterned dielectric layer on the carrier board, stacking the patterned metal line layer and the patterned dielectric layer to form a redistribution layer, and forming a grounding line layer from at least a portion of the metal line layer close to or covering or spanning at least a portion of scribe lines;

disposing a chip, and/or a chip-bearing package, and/or a passive device on a first face of the redistribution layer and electrically connecting the chip, and/or the chip-bearing package, and/or the passive device to the metal line layer;

disposing an electrical connector on the first face of the redistribution layer to cover or span at least a portion of the scribe lines, and electrically connecting the electrical connector to the grounding line layer;

plastic-packaging the chip and the electrical connector to form a plastic packaging layer;

removing the carrier board to form a first electrical contact block on a second face opposite to the first face of the redistribution layer;

cutting a complete package along the scribe lines to form individual packaging structures; and

forming a first shielding layer on an outside of the plastic packaging layer of each of the individual packaging structures, the first shielding layer covering at least a side face of the plastic packaging layer.

8 . The manufacturing method of the fan-out packaging structure according to claim 7 , wherein the metal line layer has a thickness of less than 10 μm and a minimum line spacing of less than 15 μm, the dielectric layer is made of one or a combination of an organic polymer resin, an organic polymer resin with an inorganic filler, an organic polymer resin with a glass fiber cloth and a filler sheet, and polyimide, and the metal line layer is made of one or a combination of copper, titanium, and titanium tungsten.

9 . The manufacturing method of the fan-out packaging structure according to claim 7 , wherein disposing the electrical connector on the first face of the redistribution layer specifically comprises:

fabricating, in a body member, a first through-hole penetrating through upper and lower surfaces of the body member, filling the first through-hole with a conductive filler and coating a bottom face of the body member with the conductive filler to electrically connect the body member to the grounding line layer by means of the conductive filler, the first through-hole covering or spanning at least a portion of scribe lines.

10 . The manufacturing method of the fan-out packaging structure according to claim 7 , wherein before fabricating the first shielding layer, the method further comprises the steps of:

fabricating one or more shielding layers on the plastic packaging layer to form a second shielding layer;

fabricating a plurality of shielding-layer grooves or shielding-layer through-holes in the second shielding layer; and

filling or plating the shielding-layer grooves or shielding-layer through-holes with a material of the first shielding layer, the second shielding layer has a different shielding coefficient from that of the first shielding layer in at least a portion of frequency range.