Apparatus and method for selectively forming a shielding layer on a semiconductor package
View Patent ↗An apparatus for selectively forming a shielding layer on a semiconductor package is provided. The apparatus includes: a tray including a plurality of package seats, the tray defines, for each of the plurality of package seats, one or more sets of guide holes outside the package seat; deposition masks, each of the deposition masks includes: a set of pins releasably inserted within one set of the one or more sets of guide holes to place the deposition mask on the tray; and a cover attached to the set of pins, the cover is configured to cover at least a portion of an outer surface of a semiconductor package received within a package seat when the set of pins is inserted within the set of guide holes associated with the package seat; and a deposition source configured to deposit a shielding material.
1 . An apparatus for selectively forming a shielding layer on a semiconductor package, comprising:
a tray comprising a plurality of package seats each being configured to receive the semiconductor package, wherein the tray defines each of the plurality of package seats, one or more sets of guide holes outside the plurality of package seats;
deposition masks, wherein each of the deposition masks comprises:
a set of pins releasably inserted within one set of the one or more sets of guide holes to place the deposition mask on the tray; and
a cover attached to the set of pins, wherein the cover is configured to cover at least a portion of an outer surface of the semiconductor package received within the plurality of package seats when the set of pins is inserted within the one or more sets of guide holes associated with the plurality of package seats; and
a deposition source configured to deposit a shielding material onto the tray to form the shielding layer on the semiconductor packages when received in the plurality of package seats.
2 . The apparatus of claim 1 , wherein the cover of each of the deposition masks comprises:
a top portion configured to at least partially cover a top surface of the semiconductor package; and
a bottom portion extending between the top portion and the set of pins, wherein the bottom portion is configured to cover at least a portion of a lateral surface of the semiconductor package.
3 . The apparatus of claim 2 , wherein the bottom portion has a height equal to a thickness of the semiconductor package.
4 . The apparatus of claim 1 , further comprising a connection frame for connecting two or more of the deposition masks with each other.
5 . The apparatus of claim 4 , wherein the connection frame is further configured to connect all of the deposition masks with each other, and the connection frame is integrally formed with the deposition masks.
6 . The apparatus of claim 4 , wherein the connection frame is further configured to connect two or more of the deposition masks with each other such that the connected deposition masks correspond to a row, a column, a section or all of the plurality of package seats.
7 . The apparatus of claim 1 , wherein each set of the one or more sets of guide holes are disposed around a corner of a corresponding package seat.
8 . The apparatus of claim 1 , wherein the cover defines a cavity having an inner surface, and wherein the inner surface clings to a covered portion of an outer surface of the semiconductor package received within the plurality of package seats.
9 . The apparatus of claim 1 , wherein each deposition mask further comprises:
a set of fasteners mechanically coupled to the set of pins, respectively, to secure the deposition masks to the tray.
10 . The apparatus of claim 1 , wherein the one or more sets of guide holes are through-holes.