IP Library › Granted Patent US 12,713,942
Granted Patent B2
US 12,713,942 · App. 18/345,867 · Granted Aug 18, 2026

Chiplet-to-chiplet protocol switch

Inventors: Belgacem Haba (Saratoga, CA); Rajesh Katkar (Milpitas, CA); Abul Nuruzzaman (Saratoga, CA)
Assignee: Adeia Semiconductor Bonding Technologies Inc.
H10W70/60H10W70/611H10W90/00H10W74/00H10W90/794
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Quick Facts
Patent No.
US 12,713,942
App. No.
18/345,867
Granted
Aug 18, 2026
Kind
B2
Abstract

A bonded structure is disclosed. The bonded structure can include a carrier. The bonded structure can include a first die having a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal. The bonded structure can also include a protocol switch die having circuitry to receive the communications signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol. The protocol switch die can transmit the communication signal according to the second communication protocol. The bonded structure can also include a second die having a second communications circuitry to receive the communication signal formatted in the second communication protocol.

Claims (34)

1 . A bonded structure comprising:

a carrier;

a first die comprising a first communication circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal, the first die directly bonded to the carrier without an intervening adhesive;

a protocol switch die directly bonded to the carrier without an intervening adhesive, the protocol switch die comprising circuitry to receive the communication signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol, wherein the protocol switch die transmits the communication signal according to the second communication protocol; and

a second die comprising a second communication circuitry to receive the communication signal formatted in the second communication protocol, the second die directly bonded to the carrier without an intervening adhesive.

2 . The bonded structure of claim 1 , wherein the protocol switch die further converts the second communication protocol to the first communication protocol.

3 . The bonded structure of claim 1 , wherein the first communication circuitry receives the communication signal from the protocol switch die.

4 . The bonded structure of claim 1 , wherein the second communication circuitry transmits the communication signal.

5 . The bonded structure of claim 1 , wherein a first nonconductive bonding layer of the carrier is directly bonded to a second nonconductive layer of the first die without an intervening adhesive, and

wherein a first contact feature of the carrier is directly bonded to a second contact feature of the first die without an intervening adhesive.

6 . The bonded structure of claim 5 , wherein the first nonconductive bonding layer of the carrier is directly bonded to a third nonconductive layer of the second die without an intervening adhesive; and

wherein the first contact feature of the carrier is directly bonded to a third contact feature of the second die without the intervening adhesive.

7 . The bonded structure of claim 5 , wherein the first nonconductive bonding layer of the carrier is directly bonded to a fourth nonconductive layer of the protocol switch die without an intervening adhesive; and

wherein the first contact feature of the carrier is directly bonded to a fourth contact feature of the protocol switch die without an intervening adhesive.

8 . The bonded structure of claim 1 , wherein the protocol switch die comprises a multiplexer to receive at least one protocol of a plurality of incoming communication protocols and to convert the at least one protocol of the plurality of incoming communication protocols to at least one protocol of a plurality of outgoing communication protocols based at least on a control input.

9 . A bonded structure comprising:

a carrier comprising protocol switch circuitry to convert between a first communication protocol to a second communication protocol;

a first die directly bonded to the carrier without an intervening adhesive, the first die comprising a first communication circuitry to format a communication signal according to the first communication protocol and to transmit the communication signal to the protocol switch circuitry; and

a second die directly bonded to the carrier without an intervening adhesive, the second die comprising a second communication circuitry to receive the communication signal formatted according to the second communication protocol from the protocol switch circuitry, wherein the second communication protocol is different from the first communication protocol.

10 . The bonded structure of claim 9 , wherein the protocol switch circuitry comprises a processing circuitry to convert the first communication protocol to the second communication protocol.

11 . The bonded structure of claim 9 , wherein the protocol switch circuitry further converts the first communication protocol to a plurality of communication protocols.

12 . The bonded structure of claim 11 , wherein the protocol switch circuitry further converts the plurality of communication protocols to the first communication protocol.

13 . The bonded structure of claim 11 , wherein the protocol switch circuitry further converts the plurality of communication protocols to a second plurality of communication protocols.

14 . The bonded structure of claim 9 , wherein the protocol switch circuitry is embedded within the carrier.

15 . The bonded structure of claim 9 , wherein the protocol switch circuitry is patterned on the carrier.

16 . A bonded structure comprising:

a carrier;

a first integrated device die comprising a first communication circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal, the first integrated device die directly bonded to the carrier without an intervening adhesive;

a second integrated device die disposed in or on the carrier, the second integrated device die comprising protocol switch circuitry to receive the communication signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol, wherein the second integrated device die transmits the communication signal according to the second communication protocol; and

a third integrated device die comprising a second communication circuitry to receive the communication signal formatted in the second communication protocol.

17 . The bonded structure of claim 16 , wherein the second integrated device die further comprises a memory to store various communication protocols.

18 . The bonded structure of claim 16 , wherein a format of the first communication protocol and a format of the second communication protocol is based on at least one of architecture, data rate, number of input/output interconnects, voltages, clock speed, power, latency, bit error rate, or channel loss.

19 . The bonded structure of claim 16 , wherein the second integrated device die and the third integrated device die are directly bonded to the carrier without an intervening adhesive.

20 . The bonded structure of claim 16 , wherein the second integrated device die and the third integrated device die are flip chip bonded to the carrier.