Electronic apparatus

1 . An electronic apparatus comprising:

a substrate made of an insulator; and

a circuit mounted on the substrate, the circuit including a first conductive part having a plurality of layers in a predetermined lamination direction and a second conductive part having a plurality of layers in a portion positioned away from the first conductive part in a direction orthogonal to the lamination direction, a potential of the second conductive part being different from that of the first conductive part,

wherein

the first conductive part includes a first surface layer part that constitutes an end layer in the laminate direction and a first inner layer part that constitutes a layer different from the first surface layer part in the substrate;

the second conductive part includes a second surface layer part that constitutes an end layer in the laminate direction, facing the first surface layer with a creeping distance therebetween, and a second inner layer part that constitutes a layer different from the second surface layer part in the substrate; and

at least one of a first protruded configuration and a second protruded configuration is provided, the first protruded configuration being configured such that the first inner layer part includes a first conductive protrusion protruding towards the second conductive part from the first surface layer part in a plan view when viewed in the lamination direction, and the second protruded configuration being configured such that the second inner layer part includes a second conductive protrusion protruding towards the first conductive part from the second surface layer part in a plan view when viewed in the lamination direction,

wherein

the circuit includes a drive circuit that drives a switch of an inverter and a control circuit that controls the drive circuit; and

the first conductive part serves as a part of the drive circuit and the second conductive part serves as a part of the control circuit.

2 . The electronic apparatus according to claim 1 , wherein

at least one of the first protruded configuration and the second protruded configuration is provided at more than or equal to half of sections in all of facing sections where the first surface layer part and the second surface layer part face each other with the creeping distance therebetween.

3 . The electronic apparatus according to claim 2 , wherein

at least one of the first protruded configuration and the second protruded configuration is provided at all of the facing sections.

4 . The electronic apparatus according to claim 1 , wherein

the first protruded configuration is configured such that the first inner layer part most adjacently positioned to the first surface layer part includes the first conductive protrusion; and

the second protruded configuration is configured such that the second inner layer part most adjacently positioned to the second surface layer part includes the second conductive protrusion.

5 . The electronic apparatus according to claim 1 , wherein

the first protruded configuration is configured such that the first conductive protrusion protrudes towards the second conductive part from the first surface layer part by 50 μm or more in the plan view; and

the second protruded configuration is configured such that the second conductive protrusion protrudes towards the first conductive part from the second surface layer part by 50 μm or more in the plan view.

6 . The electronic apparatus according to claim 1 , wherein

the first protruded configuration is configured such that the first conductive protrusion protrudes towards the second conductive part from the first surface layer part within a range of 10% or less of the creeping distance in the plan view; and

the second protruded configuration is configured such that the second conductive protrusion protrudes towards the first conductive part from the second surface layer part within a range of 10% or less of the creeping distance in the plan view.

7 . The electronic apparatus according to claim 1 , wherein

the first protruded configuration is configured such that a predetermined layer in the first inner layer part protrudes towards the second conducive part from the first surface layer part by a predetermined first protrusion length to form the first conductive protrusion, and a layer different from the predetermined layer in the first inner layer protrudes towards the second conducive part from the first surface layer part by a length different from the first protrusion length to form the first conductive protrusion; and

the second protruded configuration is configured such that a predetermined layer in the second inner layer part protrudes towards the first conducive part from the second surface layer part by a predetermined second protrusion length to form the second conductive protrusion, and a layer different from the predetermined layer in the second inner layer protrudes towards the first conducive part from the second surface layer part by a length different from the second protrusion length to form the second conductive protrusion.

8 . The electronic apparatus according to claim 1 , wherein

at least one of a first floating configuration and a second floating configuration is provided, the first floating configuration being configured such that a floating conductive part made of a conductor is provided being positioned away from the first inner layer part towards the second conductive part in the substrate and insulated from the first inner layer part and the second inner layer part; the second floating configuration being configured such that a floating conductive part made of a conductor is provided being positioned away from the second inner layer part towards the first conductive part in the substrate and insulated from the first inner layer part and the second inner layer part.

9 . An electronic apparatus comprising:

a substrate made of an insulator; and

a circuit mounted on the substrate, the circuit including a first conductive part having a plurality of layers in a predetermined lamination direction and a second conductive part having a plurality of layers in a portion positioned away from the first conductive part in a direction orthogonal to the lamination direction, a potential of the second conductive part being different from that of the first conductive part,

wherein

the first conductive part includes a first surface layer part that constitutes an end layer in the laminate direction and a first inner layer part that constitutes a layer different from the first surface layer part in the substrate;

the second conductive part includes a second surface layer part that constitutes an end layer in the laminate direction, facing the first surface layer with a creeping distance therebetween, and a second inner layer part that constitutes a layer different from the second surface layer part in the substrate; and

at least one of a first protruded configuration and a second protruded configuration is provided, the first protruded configuration being configured such that the first inner layer part includes a first conductive protrusion protruding towards the second conductive part from the first surface layer part in a plan view when viewed in the lamination direction, and the second protruded configuration being configured such that the second inner layer part includes a second conductive protrusion protruding towards the first conductive part from the second surface layer part in a plan view when viewed in the lamination direction,

wherein

the circuit includes a plurality of drive circuits that drive a plurality of switches of the inverter; and

the first conductive part serves as a part of predetermined drive circuits and the second conductive part serves as a part of the drive circuit other than the predetermined drive circuits.