Pick and place method with detecting an event

1 . A pick and place method, comprising:

(a) providing at least one semiconductor element disposed on a source storage location;

(b) picking up the at least one semiconductor element from the source storage location;

(c) transferring the at least one semiconductor element to a temporary storage device according to a signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform;

(d) positioning the at least one semiconductor element over the cavity of the temporary storage device, an edge of a bottom surface of the at least one semiconductor element is disposed on the top surface of the platform, such that the bottom surface of the at least one semiconductor element extends across the cavity and is spaced apart from a bottom surface of the cavity by a recessing depth of the cavity to prevent the bottom surface of the at least one semiconductor element from being damaged by the platform; and

(e) picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.

2 . The pick and place method of claim 1 , wherein the signal is sent by a controller after detecting an event.

3 . The pick and place method of claim 1 , wherein the temporary storage device further includes at least one optical detector; wherein in (c), the at least one semiconductor element is placed on the platform; and (d) comprises:

(d1) detecting a position of the at least one semiconductor element from below the platform using the at least one optical detector.

4 . The pick and place method of claim 3 , wherein after (d1), the method further comprises:

(d2) adjusting the position of the at least one semiconductor element.

5 . The pick and place method of claim 3 , wherein in (b), the at least one semiconductor element is picked up by a picked-up head, and after (d1), the method further comprises:

(d2) adjusting a position of the picked-up head according to the position of the at least one semiconductor element.

6 . The pick and place method of claim 3 , wherein the temporary storage device further includes an optical camera corresponding to the at least one semiconductor element, and (d1) comprises:

(d11) capturing an image of the at least one semiconductor element from below the platform using the optical camera.

7 . The pick and place method of claim 6 , wherein in (d11), an image light of the optical camera penetrates the platform to arrive the at least one semiconductor element.

8 . The pick and place method of claim 3 , wherein in (d1), a detecting light of the at least one optical detector penetrates the platform to arrive the at least one semiconductor element.

9 . The pick and place method of claim 1 , wherein the temporary storage device further includes at least one optical detector; wherein in (c), the at least one semiconductor element is placed on the platform; and (d) comprises:

(d1) detecting a position of the at least one semiconductor element from above the platform using the at least one optical detector.

10 . The pick and place method of claim 9 , wherein the temporary storage device further includes an optical camera corresponding to the at least one semiconductor element, and (d1) comprises:

(d11) capturing an image of the at least one semiconductor element from above the platform using the optical camera.

11 . A pick and place method, comprising:

(a) picking up at least one semiconductor element by a picked-up head, wherein the at least one semiconductor element comprises a circuit layer over a substrate and a bonding pad on the circuit layer;

(b) sending a signal to the picked-up head after detecting an event; and

(c) placing the at least one semiconductor element on a temporary storage device according to the signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform, and the at least one semiconductor element is placed on the top surface of the platform and over the cavity, such that a bottom surface of the at least one semiconductor element extends across the cavity, and the bonding pad is spaced apart from a bottom surface of the cavity by at least a depth of the cavity.

12 . The pick and place method of claim 11 , wherein the signal is a reset signal, an alarm signal, or a failure signal.

13 . The pick and place method of claim 11 , wherein after (c), the method further comprises:

(d) positioning the at least one semiconductor element via the temporary storage device.

14 . The pick and place method of claim 13 , wherein the temporary storage device further includes at least one optical detector; wherein in (c), the at least one semiconductor element is placed on the platform; and (d) comprises:

(d1) detecting a position of the at least one semiconductor element from below the platform using the at least one optical detector.

15 . The pick and place method of claim 14 , wherein the temporary storage device further includes a moving stage located below the platform, and after (d1), the method further comprises:

(d2) moving the platform to adjust the position of the at least one semiconductor element by the moving stage.

16 . The pick and place method of claim 13 , wherein the temporary storage device further includes at least one optical detector; wherein in (c), the at least one semiconductor element is placed on the platform; and (d) comprises:

(d1) detecting a position of the at least one semiconductor element from above the platform using the at least one optical detector.

17 . The pick and place method of claim 11 , wherein the event is earthquake, software failure, hardware failure, or power outage.

18 . A pick and place method, comprising:

(a) picking up the at least one semiconductor element by a picked-up head;

(b) sending a signal to the picked-up head after detecting an event;

(c) transferring the at least one semiconductor element to a temporary storage device according to a signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform;

(d) positioning the at least one semiconductor element on the top surface of the platform and over the cavity according to a detection result of a position of the at least one semiconductor element, such that a bottom surface of the at least one semiconductor element extends across the cavity and is spaced apart from a bottom surface of the cavity by a vertical distance between the top surface of the platform and the bottom surface of the cavity; and

(e) picking up and transferring the positioned semiconductor element by the picked-up head to a destination storage location.

19 . The pick and place method of claim 18 , wherein in (d), the at least one semiconductor element is positioned by placing a circuit layer and inner vias of the at least one semiconductor element within an upward projection area of the cavity.

20 . The pick and place method of claim 18 , wherein (d) comprises:

(d1) detecting the position of the at least one semiconductor element from below the platform using at least one optical detector.