Corrosive gas scavenging component for a power semiconductor component
An improved power module is disclosed. The power module comprises a power semiconductor component. The power module comprises an encasing configured to at least in part encase the power semiconductor component. The power module comprises a corrosive gas scavenging component placed within the encasing and configured to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing.
1 . A device, comprising:
a power semiconductor component;
an encasing configured to at least in part encase the power semiconductor component, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate; and
a corrosive gas scavenging component that is attached to an interior surface of the top cover, is encased by the encasing, and is configured to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component includes a bag or sachet.
2 . The device of claim 1 , wherein the corrosive gas scavenging component comprises a holder holding the material reactive to the one or more corrosive gases.
3 . The device of claim 1 , wherein the corrosive gas scavenging component comprises a carrier sheet impregnated with the material reactive to the one or more corrosive gases.
4 . The device of claim 3 , wherein the carrier sheet is impregnated with a powder of the material reactive to the one or more corrosive gases.
5 . The device of claim 3 , wherein the corrosive gas scavenging component comprises a cover sheet covering the carrier sheet impregnated with the material reactive to the one or more corrosive gases.
6 . The device of claim 1 , wherein the corrosive gas scavenging component is made of a material that is waterproof against liquids but allows vapor to pass through.
7 . The device of claim 1 , wherein the corrosive gas scavenging component is positioned adjacent to an encapsulant inside the encasing.
8 . The device of claim 1 , wherein the material reactive to the one or more corrosive gases comprises at least one of the following: silver or copper.
9 . The device of claim 1 , wherein the material reactive to the one or more corrosive gases comprises a material reactive to one or more of the following: atmospheric gases containing sulfur, atmospheric gases containing chlorine, or ammonia.
10 . A device, comprising:
a power semiconductor component;
an encasing configured to at least in part encase the power semiconductor component, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate; and
a corrosive gas scavenging component that is attached to an interior surface of the top cover, is encased by the encasing, and is configured to reduce corrosion of metal included in the power semiconductor component by having a material that absorbs one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component includes a bag or sachet.
11 . The device of claim 10 , wherein the corrosive gas scavenging component comprises a holder holding the material that absorbs the one or more corrosive gases.
12 . The device of claim 10 , wherein the corrosive gas scavenging component comprises a carrier sheet impregnated with the material that absorbs the one or more corrosive gases.
13 . The device of claim 12 , wherein the carrier sheet is impregnated with a powder of the material that absorbs the one or more corrosive gases.
14 . The device of claim 12 , wherein the corrosive gas scavenging component comprises a cover sheet covering the carrier sheet impregnated with the material that absorbs the one or more corrosive gases.
15 . The device of claim 10 , wherein the material that absorbs the one or more corrosive gases comprises activated carbon.
16 . A method, comprising:
providing a power semiconductor component;
encasing the power semiconductor component with an encasing, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate; and
attaching a corrosive gas scavenging component to an interior surface of the top cover within the encasing to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component is encased by the encasing, and wherein the corrosive gas scavenging component includes a bag or sachet.
17 . The method of claim 16 , wherein the corrosive gas scavenging component comprises a holder holding the material reactive to the one or more corrosive gases.
18 . The method of claim 16 , wherein the corrosive gas scavenging component comprises a carrier sheet impregnated with the material reactive to the one or more corrosive gases.
19 . The method of claim 18 , further comprising:
impregnating the carrier sheet with a powder of the material reactive to the one or more corrosive gases.