Granted Patent
Utility
US 6,479,903 · App. 09/877,324
Flip chip thermally enhanced ball grid array
Inventor:
John Briar
Patented Case
View Patent ↗
Granted: Nov 12, 2002
Filed: Jun 11, 2001
Inventor
John Briar
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.