IP Library › Granted Patent US 6,630,373
Granted Patent Utility
US 6,630,373 · App. 10/083,993

Ground plane for exposed package

Inventors: Jeffrey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee, Byung Joon Han
Patented Case View Patent ↗
Granted: Oct 7, 2003 Filed: Feb 26, 2002
Inventors
Jeffrey D. Punzalan
Hien Boon Tan
Zheng Zheng
Jae Hak Yee
Byung Joon Han
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.

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Quick Facts
Patent No.
US 6,630,373
App. No.
10/083,993
Filed
2002-02-26
Granted
2003-10-07
Kind
B2