Granted Patent
Utility
US 6,649,445 · App. 10/241,265
Wafer coating and singulation method
Inventors:
Jing Qi, Janice Danvir, Tomasz L. Klosowiak
Patented Case
View Patent ↗
Granted: Nov 18, 2003
Filed: Sep 11, 2002
Inventors
Jing Qi
Janice Danvir
Tomasz L. Klosowiak
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.