Granted Patent
Utility
US 6,724,048 · App. 10/462,178
Body-tied silicon on insulator semiconductor device and method therefor
Inventors:
Byoung W. Min, Michael A. Mendicino, Laegu Kang
Patented Case
View Patent ↗
Granted: Apr 20, 2004
Filed: Jun 16, 2003
Inventors
Byoung W. Min
Michael A. Mendicino
Laegu Kang
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.