IP Library › Granted Patent US 6,952,346
Granted Patent B2
US 6,952,346 · App. 10/786,451 · Granted Oct 4, 2005

Etched open microchannel spray cooling

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Quick Facts
Patent No.
US 6,952,346
App. No.
10/786,451
Filed
Feb 24, 2004
Granted
Oct 4, 2005
Kind
B2
Art Unit
2835
USPC
361/699
Abstract

The present invention is a spray cooling thermal management device that cools an electronic component. Liquid coolant is dispensed upon a heated surface containing etched open microchannels.

Claims (16)

1. A thermal management system for an electronic device being cooled, said thermal management system comprising:

a top surface of said electronic device orientated to receive a dispensed fluid from an at least one sprayer;

a plurality of etched microchannels within said top surface and open to said sprayer; and

wherein said dispensed fluid creates a thin evaporative cooling film on said top surface including said plurality of etched microchannels.

2. The thermal management system of claim 1 , wherein said dispensed fluid is substantially directed down the length of said plurality of etched microchannels.

3. The thermal management system of claim 1 , wherein said sprayer is an atomizer.

4. The thermal management system of claim 1 , wherein said plurality of etched microchannels are positioned above a hotspot of said electronic device.

5. The thermal management system of claim 1 , wherein said plurality of etched microchannels each have a width generally less than 200 microns.

6. A thermal management system for an electronic device being liquid spray cooled, said thermal management system comprising:

a plate having a top surface and a bottom surface, said bottom surface bonded to said electronic device, said top surface orientated to receive a dispensed fluid from an at least one sprayer;

a plurality of etched microchannels within said top surface and open to said sprayer; and

wherein said dispensed fluid creates a thin evaporative cooling film on said top surface including said plurality of etched microchannels.

7. The thermal management system of claim 6 , wherein said dispensed fluid is substantially directed down the length of said plurality of etched microchannels.

8. The thermal management system of claim 6 , wherein said sprayer is an atomizer.

9. The thermal management system of claim 6 , wherein said plurality of etched microchannels are positioned above a hotspot of said electronic device.

10. The thermal management system of claim 6 , wherein said plurality of etched microchannels each have a width generally less than 200 microns.