IP Library › Granted Patent US 7,354,800
Granted Patent B2
US 7,354,800 · App. 11/380,596 · Granted Apr 8, 2008

Method of fabricating a stacked integrated circuit package system

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Quick Facts
Patent No.
US 7,354,800
App. No.
11/380,596
Filed
Apr 27, 2006
Granted
Apr 8, 2008
Kind
B2
Art Unit
2814
USPC
438/109
Abstract

An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate and the base substrate, and applying an encapsulant having the core substrate partially exposed over the base integrated circuit.

Claims (41)

1. An integrated circuit package system comprising:

providing a base substrate;

attaching a base integrated circuit on the base substrate, wherein attaching the base integrated circuit comprises applying a moldcap over the base integrated circuit and part of the base substrate;

attaching a core substrate over the base integrated circuit;

attaching a substrate electrical connector between the core substrate and the base substrate; and

applying an encapsulant having the core substrate partially exposed over the base integrated circuit.

2. The system as claimed in claim 1 further comprising attaching a top integrated circuit on a mounting surface of the core substrate.

3. The system as claimed in claim 1 wherein attaching the base integrated circuit comprises attaching a solder ball or a bond wire between the base integrated circuit and the base substrate.

4. The system as claimed in claim 1 wherein attaching the base integrated circuit comprises attaching another integrated circuit on the base integrated circuit.

5. An integrated circuit package system comprising:

forming a base substrate having a base connection pad;

connecting a base integrated circuit with a base electrical connector on the base substrate, wherein connecting the base integrated circuit comprises attaching a bond wire between another integrated circuit on the base integrated circuit and the base substrate;

attaching a core substrate on an attachment layer over the base integrated circuit;

connecting a substrate electrical connector between the core substrate and the base substrate;

forming an encapsulant over the core substrate having a core connection pad exposed over the base integrated circuit; and

connecting a top electrical connector between a top integrated circuit and the core connection pad.

6. The system as claimed in claim 5 wherein connecting the base integrated circuit comprises attaching a flipchip on the base integrated circuit.

7. The system as claimed in claim 5 wherein forming the encapsulant comprises forming a mounting surface on the core substrate for a top integrated circuit.

8. The system as claimed in claim 5 wherein attaching the core substrate comprises providing the core substrate with a cost lower than a cost of the base substrate.

9. An integrated circuit package system comprising:

a base substrate;

a base integrated circuit on the base substrate;

a core substrate over the base integrated circuit;

a substrate electrical connector between the core substrate and the base substrate;

an encapsulant having the core substrate partially exposed over the base integrated circuit; and

a moldcap over the base integrated circuit and part of the base substrate.

10. The system as claimed in claim 9 further comprising a top integrated circuit on a mounting surface of the core substrate.

11. The system as claimed in claim 9 further comprising a solder ball or a bond wire between the base integrated circuit and the base substrate.

12. The system as claimed in claim 9 further comprising another integrated circuit on the base integrated circuit.

13. The system as claimed in claim 9 wherein:

the base substrate having a base connection pad;

the base integrated circuit with a base electrical connector on the base substrate;

the core substrate on an attachment layer over the base integrated circuit;

the substrate electrical connector between the core substrate and the base substrate;

the encapsulant over the core substrate having a core connection pad exposed over the base integrated circuit; and

further comprising:

a top electrical connector between a top integrated circuit and the core connection pad.

14. The system as claimed in claim 13 further comprising a bond wire between another integrated circuit on the base integrated circuit and the base substrate.

15. The system as claimed in claim 13 further comprising a flipchip on the base integrated circuit.

16. The system as claimed in claim 13 wherein the encapsulant comprises a mounting surface on the core substrate for a top integrated circuit.

17. The system as claimed in claim 13 wherein the core substrate comprises a cost lower than a cost of the base substrate.