Over-molded keypad and method of manufacture
View Patent ↗Described is a keypad and its method of manufacture. In one embodiment, a keypad is provided that includes a substrate having a plurality of donut-shaped recesses located at each site of a button for inputting user information, a plurality of cushions each filled with an incompressible fluid (e.g., water), a flex circuit layer, a plurality of metal membranes and an over-molded thermoplastic elastomer layer. During the over-molding of the thermoplastic elastomer layer, the plurality of cushions filled with an incompressible fluid prevents collapse of the space between the flex circuit layer and the plurality of metal membranes. After the layers of the keypad are assembled, the incompressible fluid is removed which leaves a space between the flex circuit layer and the plurality of metal membranes.
1. A method of forming a keypad, the method comprising:
providing:
a substrate having a plurality of donut-shaped recesses located at each site of a key button for inputting user information;
a plurality of polymer cushions each filled with an incompressible fluid;
a flex circuit layer;
a plurality of metal membranes;
a plurality of plastic adhesive layers; and
a thermoplastic elastomer layer;
forming a plurality of switch assemblies by:
adhering a cushion to each of the plurality of donut-shaped recesses;
placing a flex circuit layer above all of the cushions;
adhering the plurality of metal membranes to the flex circuit layer; and
swaging the plurality of switch assemblies to the substrate;
over-molding the thermoplastic elastomer layer over the plurality of switch assemblies to form a keypad; and
deflating each of the cushions by removing the incompressible fluid such that a cavity is formed between each of the plurality of metal membranes and the flex circuit layer.
2. The method of claim 1 , wherein the incompressible fluid is water.
3. A keypad comprising:
a substrate having a plurality of donut-shaped recesses located at each site of a button for inputting user information;
a plurality of switch assemblies formed on the substrate comprising:
a cushion adhered in the recess;
a flex circuit layer above the cushion;
a plurality of metal membranes adhered to the flex circuit layer; and
an thermoplastic elastomer layer over-molded above the plurality of switch assemblies.
4. The keypad of claim 3 , wherein the thermoplastic elastomer is thermoplastic urethane.
5. The keypad of claim 4 , wherein the thermoplastic urethane is TEXIN 245.
6. The keypad of claim 3 , wherein the plastic layer is formed from Mylar.