IP Library › Granted Patent US 7,467,464
Granted Patent B2
US 7,467,464 · App. 11/987,621 · Granted Dec 23, 2008

Method of manufacturing a memory card

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Quick Facts
Patent No.
US 7,467,464
App. No.
11/987,621
Filed
Dec 3, 2007
Granted
Dec 23, 2008
Kind
B2
Art Unit
3729
USPC
29/841
Abstract

A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.

Claims (26)

1. A method for manufacturing a Multi Media Card comprising steps of:

(a) providing a substrate;

(b) after the step (a), mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate;

(c) after the step (b), molding the first flash memory chip and the controller chip by a resin;

(d) after the step (c), providing a case having a main surface and a back surface, and the back surface of the case has a first recess and a second recess; and

(e) after the step (d), covering the resin and the front surface of the substrate by the case;

wherein the depth of the first recess is deeper than the depth of the second recess,

wherein the resin is fitted in the first recess,

wherein an edge portion of the substrate is fitted in the second recess,

wherein the substrate warps so that a central portion of the substrate projects in a direction away from the case.

2. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein the edge portion of the substrate is put in contact with the bottom of the second recess.

3. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein a thermal expansion coefficient of the resin is larger than a thermal expansion coefficient of the substrate.

4. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein the resin has a thermal expansion coefficient in the range of about 9×10 −6 /° C. to about 16×10 −6 /° C., and

wherein the substrate has a thermal expansion coefficient in the range of 1.3×10 −6 /° C. to 1.6×10 −6 /° C.

5. The method for manufacturing a Multi Media Card according to claim 4 ,

wherein the substrate is formed of a glass fabric-based epoxy resin.

6. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein, at the step (e), an adhesive is used.

7. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein a plurality of electrode terminals are formed over the substrate, and the electrode terminals are electrically connected to the first flash memory chip and the controller chip.

8. The method for manufacturing a Multi Media Card according to claim 1 ,

wherein the Multi Media Card further comprises a second flash memory chip, and

wherein the second flash memory chip is stacked over the first flash memory chip.