Methods of forming NAND memory with virtual channel
View Patent ↗A string of nonvolatile memory cells are connected together by source/drain regions that include an inversion layer created by fixed charge in an overlying layer. Control gates extend between floating gates so that two control gates couple to a floating gate. A fixed charge layer may be formed by plasma nitridation.
1. A method of forming a nonvolatile memory array comprising:
forming a plurality of floating gates overlying a substrate surface;
forming a plurality of fixed charge layer portions overlying the substrate surface, the plurality of fixed charge layer portions interspersed between the plurality of floating gates, each of the plurality of fixed charge layer portions formed having fixed electrical charge, the fixed charge layer portions cause formation of conductive source/drain regions in the substrate; and
forming a plurality of control gates overlying the plurality of fixed charge layer portions.
2. The method of claim 1 wherein the conductive source/drain regions electrically connect memory cells to form a NAND string.
3. The method of claim 1 wherein the fixed charge layer is formed by nitridation of Silicon dioxide.
4. The method of claim 3 wherein the nitridation is a plasma nitridation.
5. The method of claim 1 wherein the plurality of control gates are formed by blanket deposition of a conductive material and subsequent removal of conductive material overlying floating gates.
6. The method of claim 1 wherein floating gates are formed to have a dimension that is less than the minimum feature size of a lithographic process used to form the memory array.
7. The method of claim 1 wherein the plurality of floating gates are formed to individually have an inverted-T shape in cross section.
8. A method of forming a nonvolatile memory array comprising:
forming a gate dielectric layer over a substrate surface;
subsequently forming a plurality of floating gates overlying the gate dielectric layer;
subsequently forming a plurality of fixed charge layer portions, individual fixed charge layer portions overlying the substrate surface between floating gates, the fixed charge layer portions create conductive source/drain regions in the substrate that connect memory cells to form NAND strings;
forming an interlayer dielectric layer over the plurality of floating gates; and
forming a plurality of control gates between floating gates.
9. The method of claim 8 wherein fixed charge layer portions are formed by plasma nitridation or plasma oxidation.
10. The method of claim 8 wherein the plurality of control gates are formed by depositing a blanket layer of conductive material and subsequently removing excess conductive material to leave conductive material between floating gates so that control gates are self-aligned to floating gates.
11. The method of claim 10 wherein control gates extend in a first direction and the NAND strings extend in a second direction that is perpendicular to the first direction.
12. The method of claim 8 wherein the plurality of floating gates are formed to have an inverted-T shape in cross-section.
13. The method of claim 1 , wherein the floating gates are a part of a NAND string and the fixed charge layers extend from one floating gate to the adjacent floating gate in the NAND string.
14. The method of claim 8 , wherein the source/drain regions are formed in the substrate without doping the substrate to form the source/drain regions.
15. A method of forming a memory array comprising:
forming a plurality of floating gates overlying a substrate surface;
forming a fixed charge layer overlying the substrate surface, the fixed charge layer formed having fixed electrical charge, the fixed charge layer causes formation of conductive source/drain regions in portions of the substrate between the floating gates; and
forming a plurality of control gates.
16. The method of claim 15 wherein the conductive source/drain regions electrically connect memory cells to form a NAND string.
17. The method of claim 15 further comprising patterning the fixed charge layer into a plurality of fixed charge layer portions interspersed between the plurality of floating gates.
18. The method of claim 15 wherein the forming a fixed charge layer includes:
depositing a layer of material;
adding charge to the layer of material.
19. The method of claim 15 wherein the plurality of control gates are formed by blanket deposition of a conductive material and subsequent removal of conductive material overlying floating gates.