IP Library › Granted Patent US 7,582,957
Granted Patent B2
US 7,582,957 · App. 11/558,404 · Granted Sep 1, 2009

Integrated circuit package system with encapsulation lock

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Quick Facts
Patent No.
US 7,582,957
App. No.
11/558,404
Filed
Nov 9, 2006
Granted
Sep 1, 2009
Kind
B2
Art Unit
2823
USPC
257/676
Abstract

An integrated circuit package system is provided including forming a paddle having holes with a hole size in a range about tens to hundreds of micrometers, mounting a device over the paddle, and filling an encapsulation in the holes.

Claims (28)

1. An integrated circuit package system comprising:

forming a paddle having a groove with holes through the groove, the holes having a hole size in a range about tens to hundreds of micrometers and the paddle having a plating at a peripheral region of the paddle;

mounting a device over the paddle; and

filling an encapsulation in the holes.

2. The system as claimed in claim 1 wherein forming the paddle having the holes includes forming the paddle having through holes and depressions.

3. The system as claimed in claim 1 further comprising forming a plating on the paddle with the holes through the plating.

4. An integrated circuit package system comprising:

forming a die-attach paddle having holes with a diameter in a range about tens to hundreds of micrometers and a ratio of the diameter and a separation between the holes in a range about 1:2 to 2:1;

mounting an integrated circuit die over the die-attach paddle; and

filling an encapsulation in the holes.

5. The system as claimed in claim 4 wherein forming the die-attach paddle having the holes includes forming the holes in a circular geometric shape.

6. The system as claimed in claim 4 wherein forming the die-attach paddle having the holes and the separation between the holes are in micrometer scale includes forming the holes at a peripheral region of the paddle.

7. The system as claimed in claim 4 wherein forming the die-attach paddle having the holes includes forming a tie bar connected to the die-attach paddle.

8. The system as claimed in claim 4 further comprising connecting an external interconnect and the integrated circuit die.

9. An integrated circuit package system comprising:

a paddle having a groove and holes through the groove, the holes having a hole size in a range about tens to hundreds of micrometers and the paddle having a plating at a peripheral region of the paddle;

a device over the paddle; and

an encapsulation in the holes.

10. The system as claimed in claim 9 wherein the paddle having the holes includes through holes and depressions.

11. The system as claimed in claim 9 further comprising a plating on the paddle with the holes through the plating.

12. The system as claimed in claim 9 wherein:

the paddle is a die-attach paddle having the holes with a diameter in a range about tens to hundreds of micrometers and a ratio of the diameter and a separation between the holes in a range about 1:2 to 2:1;

the device is an integrated circuit die over the paddle; and

the encapsulation in the holes is a cover for the device.

13. The system as claimed in claim 12 wherein the die-attach paddle having the holes has the holes in a circular geometric shape.

14. The system as claimed in claim 12 wherein the die-attach paddle having the holes has the holes at a peripheral region of the paddle.

15. The system as claimed in claim 12 wherein the die-attach paddle is connected to a tie bar.

16. The system as claimed in claim 12 further comprising an internal interconnect between an external interconnect and the integrated circuit die.