Integrated circuit package system including stacked die
View Patent ↗An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
1. An integrated circuit package system comprising:
a die with bond pads formed on the die and a planarized bottom exposed surface;
a solder bump deposited on one or more bond pads;
a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump; and
a recess formed into the edges of the mold compound to expose a portion of the solder bump.
2. The system as claimed in claim 1 wherein the exposed portion of the solder bump further comprises:
a top portion of the solder bump.
3. The system as claimed in claim 1 wherein the recess is above the bond pads.
4. The system as claimed in claim 1 further comprising:
a wire bond attached to the exposed portion of the solder bump in the recess.
5. An integrated circuit package system comprising:
a die with bond pads formed on the die;
a solder bump deposited on one or more bond pads;
a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump;
a recess formed into the edges of the mold compound to expose a portion of the solder bump;
a printed circuit board connected to a bottom exposed surface of the die; and
electrical connectors connected to the exposed portion of the solder bump and the printed circuit board, wherein a combined height of the mold compound and the die is at least greater than a height of the electrical connectors.
6. The system as claimed in claim 5 wherein the electrical connectors further comprises:
wire bonds attached to the exposed portion of the solder bump; and
bond wires electrically coupled to the wire bonds and the printed circuit board.
7. The system as claimed in claim 5 further comprising:
a semiconductor structure mounted on the mold compound.
8. The system as claimed in claim 7 further comprising:
a layer of laminate film deposited between the semiconductor structure and the mold compound.
9. The system as claimed in claim 5 further comprising:
an encapsulant encapsulating the electrical connectors, the die, and the mold compound.