Integrated circuit package system employing structural support

1. An integrated circuit package system comprising:

providing an electrical interconnect system including a support structure and a lead-finger system;

stacking a first device over the support structure;

stacking a second device over the first device to expose a first device bonding pad;

connecting the first device and the second device to the lead-finger system;

stacking a dummy device over the second device; and

exposing a support structure bottom side and a dummy device top side from an encapsulation material for thermal dissipation.

2. The system as claimed in claim 1 wherein:

stacking the dummy device over the second device includes stacking an inactive semiconductor die/package, a spacer, an electromagnetic interference shield, a thermally conductive layer, or a combination thereof.

3. The system as claimed in claim 1 wherein:

stacking the dummy device over the second device provides structural rigidity to the integrated circuit package system.

4. The system as claimed in claim 1 wherein:

stacking the second device includes offsetting the second device.

5. The system as claimed in claim 1 further comprising:

configuring the lead-finger system to include a single in-line lead.

6. An integrated circuit package system comprising:

providing an electrical interconnect system including a support structure and a lead-finger system;

stacking a first device over the support structure;

stacking a first inter-device structure over the first device;

stacking a second device over the first inter-device structure;

connecting the first device and the second device to the lead-finger system;

stacking a second inter-device structure over the second device;

stacking a dummy device over the second inter-device structure; and

depositing an encapsulation material that exposes a support structure bottom side and a dummy device top side.

7. The system as claimed in claim 6 wherein:

stacking the first inter-device structure includes offsetting the first inter-device structure to expose a first device bonding pad.

8. The system as claimed in claim 6 wherein:

stacking the first inter-device structure and the second inter-device structure includes stacking an adhesive with or without thermally conducting capabilities, a spacer, an electromagnetic interference shield for blocking potentially disruptive energy fields, or a combination thereof.

9. The system as claimed in claim 6 further comprising:

configuring the integrated circuit package system to prevent warpage.

10. The system as claimed in claim 6 further comprising:

configuring the integrated circuit package system to be part of a package-in-package system.

11. An integrated circuit package system comprising:

an electrical interconnect system including a support structure and a lead-finger system;

a first device over the support structure; a second device over the first device exposing a first device bonding pad; the first device and the second device electrically

connected to the lead-finger system; a dummy device over the second device; and

a support structure bottom side and a dummy device top side exposed from an encapsulation material for thermal dissipation.

12. The system as claimed in claim 11 wherein:

the dummy device includes an inactive semiconductor die/package, a spacer, an electromagnetic interference shield, a thermally conductive layer, or a combination thereof.

13. The system as claimed in claim 11 wherein:

the dummy device provides structural rigidity to the integrated circuit package system.

14. The system as claimed in claim 11 wherein:

the second device is offset from the first device.

15. The system as claimed in claim 11 wherein:

the lead-finger system includes a single in-line lead.

16. The system as claimed in claim 11 further comprising:

a first inter-device structure between the first device and the second device; and

a second inter-device structure between the second device and the dummy device.

17. The system as claimed in claim 16 wherein:

the first inter-device structure is offset from the first device to expose a first device bonding pad.

18. The system as claimed in claim 16 wherein:

the first inter-device structure and the second inter-device structure include an adhesive with or without thermally conducting capabilities, a spacer, an electromagnetic interference shield for blocking potentially disruptive energy fields, or a combination thereof.

19. The system as claimed in claim 11 wherein:

the integrated circuit package system configuration prevents warpage.

20. The system as claimed in claim 11 wherein:

the integrated circuit package system is part of a package-in-package system.