IP Library › Granted Patent US 7,868,434
Granted Patent B2
US 7,868,434 · App. 12/730,171 · Granted Jan 11, 2011

Integrated circuit package-on-package stacking system

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Quick Facts
Patent No.
US 7,868,434
App. No.
12/730,171
Filed
Mar 23, 2010
Granted
Jan 11, 2011
Kind
B2
Examiner
TRAN, LONG K
Art Unit
2818
USPC
438/676
Abstract

An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.

Claims (19)

1. An integrated circuit package-on-package stacking system comprising a leadframe interposer including:

a leadframe having a lead;

a molded base on a portion of the lead for only supporting the lead; and

the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.

2. The system as claimed in claim 1 further comprising a signal contact on the leadframe interposer for an electrical connection of an upper integrated circuit package.

3. The system as claimed in claim 1 wherein the leadframe interposer singulated from the leadframe includes:

a dam bar cut from the leadframe; and

a stack-up height adjusted by forming an outer lead.

4. The system as claimed in claim 1 further comprising an extension base formed on the leadframe interposer.

5. The system as claimed in claim 1 further comprising an additional contact on an extended interposer for a discrete component, an integrated circuit package, an integrated circuit die, or a combination thereof.

6. The system as claimed in claim 1 further comprising:

an electrical connection between the leadframe interposer and a base integrated circuit package; and

the electrical connection between an upper integrated circuit package and the base integrated circuit package through the leadframe interposer.

7. The system as claimed in claim 6 further comprising a signal contact on the leadframe interposer for the electrical connection to the upper integrated circuit package, in which the signal contact may be gold plated.

8. The system as claimed in claim 6 wherein the leadframe interposer singulated from the leadframe includes:

a dam bar and a frame piece cut from the leadframe; and

a stack-up height adjusted by an outer lead bent in two places.

9. The system as claimed in claim 6 further comprising an extension base formed on the leadframe interposer for the electrical contact to the base integrated circuit package.

10. The system as claimed in claim 6 further comprising an additional contact on an extended interposer for a discrete component, an integrated circuit package, an integrated circuit die, or a combination thereof includes an additional function on the extended interposer.