Integrated circuit package system employing an offset stacked configuration

1. A method for manufacturing an integrated circuit package system comprising:

providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side;

mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect; and

forming a base package body over the electrical interconnect and a portion of the first integrated circuit and the base substrate.

2. The method as claimed in claim 1 wherein:

mounting the offset package includes forming a first portion over the first integrated circuit and a second portion overhanging the base substrate.

3. The method as claimed in claim 1 wherein:

mounting the offset package includes mounting a flip integrated circuit.

4. A method for manufacturing an integrated circuit package system comprising:

providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and

mounting a first portion of an offset package over the first integrated circuit and a second portion of the offset package overhanging the base substrate, the second portion coupled to the base substrate by a system interconnect.

5. The method as claimed in claim 4 wherein:

providing the first integrated circuit coupled to the base substrate by an electrical interconnect formed on one side includes utilizing lead-in-film structures.

6. The method as claimed in claim 4 wherein:

mounting the offset package includes using an interposer as the system interconnect.

7. The method as claimed in claim 4 wherein:

mounting the offset package includes positioning the offset package to overhang one or more sides of the first integrated circuit.

8. The method as claimed in claim 4 further comprising:

mounting a passive component, an active component, or a. combination thereof on the base substrate.

9. An integrated circuit package system comprising:

a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect on one side; and

an offset package over the base package that overhangs one or more sides of the first integrated circuit, the offset package electrically coupled to the base substrate via a system interconnect.

10. The system as claimed in claim 9 further comprising:

a base package body over the electrical interconnect and a portion of the first integrated circuit and the base substrate.

11. The system as claimed in claim 9 further comprising:

a system package body over the electrical interconnect and around a portion of the offset package.

12. The system as claimed in claim 9 wherein:

the offset package includes a first portion on the first integrated circuit and a second portion overhanging the base substrate.

13. The system as claimed in claim 9 wherein:

the offset package includes a flip integrated circuit.

14. The system as claimed in claim 9 wherein:

the system interconnect includes a solder ball structure.

15. The system as claimed in claim 9 wherein:

the electrical interconnect includes a lead-in-film structure.

16. The system as claimed in claim 9 wherein:

the system interconnect includes an interposer.

17. The system as claimed in claim 9 further comprising:

a passive component, an active component, or a combination thereof on the base substrate.

18. A method for manufacturing an integrated circuit package system comprising:

providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side;

mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect; and

forming a system package body over the electrical interconnect and around a portion of the offset package.