Semiconductor device and method of shunt test measurement for passive circuits
View Patent ↗A semiconductor device has an inductor and capacitor formed on the substrate. The inductor and capacitor are electrically connected in series. The inductor is a coiled conductive layer. The capacitor has first and second conductive layers separated by an insulating layer. A first test pad and second test pad are formed on the substrate. A terminal of the inductor is coupled to the first and second test pads. A third test pad and fourth test pad are formed on the substrate. A terminal of the capacitor is coupled to the third and fourth test pads such that the inductor and capacitor are connected in shunt between the first and second test pads and the third and fourth test pads. An electrical characteristic of the inductor and capacitor such that resonant frequency and quality factor are tested using a two-port shunt measurement which negates series resistance of test probes.
1. A method of manufacturing and testing a semiconductor device, comprising:
providing a substrate;
forming an inductor on the substrate;
forming a capacitor on the substrate, the inductor and capacitor being electrically connected in series with a first terminal of the capacitor being coupled to a first terminal of the inductor;
forming first and second test pads on the substrate to be electrically common, wherein a second terminal of the inductor is coupled to the first and second test pads; and
forming third and fourth test pads on the substrate to be electrically common, wherein a second terminal of the capacitor is coupled to the third and fourth test pads such that the inductor and capacitor are connected in shunt between the first and second test pads and the third and fourth test pads.
2. The method of claim 1 , further including:
forming a coiled conductive layer for the inductor;
forming first and second conductive layers, the first conductive layer being electrically isolated from the second conductive layer; and
forming an insulating layer between the first and second conductive layers for the capacitor.
3. The method of claim 1 , further including testing an electrical characteristic of the inductor and capacitor using test probes to perform a two-port shunt measurement by applying a first voltage across the first and third test pads and applying a second voltage across the second and fourth test pads such that a first current flows through the first and third test pads and a second current flows through the second and fourth test pads.
4. The method of claim 3 , wherein the shunt measurement negates series resistance of the test probes when determining the electrical characteristic of the inductor and capacitor.
5. The method of claim 4 , wherein the electrical characteristic is resonant frequency or quality factor.
6. A semiconductor device, comprising:
a substrate;
an inductor formed on the substrate;
a capacitor formed on the substrate, the inductor and capacitor being electrically connected in series with a first terminal of the capacitor being coupled to a first terminal of the inductor;
first and second test pads formed on the substrate to be electrically common, wherein a second terminal of the inductor is coupled to the first and second test pads; and
third and fourth test pads formed on the substrate to be electrically common, wherein a second terminal of the capacitor is coupled to the third and fourth test pads such that the inductor and capacitor are connected in shunt between the first and second test pads and the third and fourth test pads.
7. The semiconductor device of claim 6 , wherein the inductor includes a coiled conductive layer and the capacitor includes first and second conductive layers and an insulating layer disposed between the first and second conductive layers.
8. The semiconductor device of claim 6 , further including:
a first conductive via electrically connecting the first terminal of the inductor to the first terminal of the capacitor;
a second conductive via electrically connecting the second terminal of the inductor to the first and second test pads; and
a third conductive via electrically connecting the second terminal of the capacitor to the third and fourth test pads.
9. The semiconductor device of claim 6 , wherein an electrical characteristic of the inductor and capacitor is tested using test probes to perform a two-port shunt measurement by applying a first voltage across the first and third test pads and applying a second voltage across the second and fourth test pads such that a first current flows through the first and third test pads and a second current flows through the second and fourth test pads.
10. The semiconductor device of claim 9 , wherein the shunt measurement negates series resistance of the test probes when determining the electrical characteristic of the inductor and capacitor.
11. The semiconductor device of claim 10 , wherein the electrical characteristic is resonant frequency or quality factor.
12. A semiconductor device, comprising:
a substrate;
a passive circuit formed on the substrate;
first and second test pads formed on the substrate to be electrically common, wherein a first terminal of the passive circuit is coupled to the first and second test pads; and
third and fourth test pads formed on the substrate to be electrically common, wherein a second terminal of the passive circuit is coupled to the third and fourth test pads such that the passive circuit is connected in shunt between the first and second test pads and the third and fourth test pads.
13. The semiconductor device of claim 12 , wherein the passive circuit includes:
an inductor formed on the substrate; and
a capacitor formed on the substrate, the inductor and capacitor being electrically connected in series with a first terminal of the capacitor being coupled to a first terminal of the inductor.
14. The semiconductor device of claim 13 , wherein the inductor includes a coiled conductive layer and the capacitor includes first and second conductive layers and an insulating layer disposed between the first and second conductive layers.
15. The semiconductor device of claim 13 , further including:
a first conductive via electrically connecting the first terminal of the inductor to the first terminal of the capacitor;
a second conductive via electrically connecting a second terminal of the inductor to the first and second test pads; and
a third conductive via electrically connecting a second terminal of the capacitor to the third and fourth test pads.
16. The semiconductor device of claim 12 , wherein an electrical characteristic of the passive circuit is tested using test probes to perform a two-port shunt measurement by applying a first voltage across the first and third test pads and applying a second voltage across the second and fourth test pads such that a first current flows through the first and third test pads and a second current flows through the second and fourth test pads.
17. The semiconductor device of claim 16 , wherein the shunt measurement negates series resistance of the test probes when determining the electrical characteristic of the passive circuit.
18. The semiconductor device of claim 17 , wherein the electrical characteristic is resonant frequency or quality factor.
19. A semiconductor device, comprising:
a substrate;
a circuit formed on the substrate, the circuit including,
(a) an inductor formed on the substrate, and
(b) a capacitor formed on the substrate, the inductor and capacitor being electrically connected in series with a first terminal of the capacitor being coupled to a first terminal of the inductor;
first, second, third, and fourth test pads formed on the substrate, the first and second test pads being electrically common and coupled to a second terminal of the capacitor, the third and fourth test pads being electrically common and coupled to a second terminal of the inductor, the circuit being coupled in shunt between the first and second test pads and the third and fourth test pads;
a first conductive via electrically connecting the first terminal of the inductor to the first terminal of the capacitor;
a second conductive via electrically connecting a second terminal of the inductor to the first and second test pads; and
a third conductive via electrically connecting a second terminal of the capacitor to the third and fourth test pads.
20. The semiconductor device of claim 19 , wherein the inductor includes a coiled conductive layer and the capacitor includes first and second conductive layers and an insulating layer disposed between the first and second conductive layers.
21. The semiconductor device of claim 19 , wherein an electrical characteristic of the circuit is tested using test probes to perform a two-port shunt measurement by applying a first voltage across the first and third test pads and applying a second voltage across the second and fourth test pads such that a first current flows through the first and third test pads and a second current flows through the second and fourth test pads.
22. The semiconductor device of claim 21 , wherein the shunt measurement negates series resistance of the test probes when determining the electrical characteristic of the circuit.
23. The semiconductor device of claim 22 , wherein the electrical characteristic is resonant frequency or quality factor.
24. A semiconductor device, comprising:
a substrate;
a passive circuit formed on the substrate; and
first, second, third, and fourth test pads formed on the substrate, the first and second test pads being electrically common and coupled to a first terminal of the passive circuit, the third and fourth test pads being electrically common and coupled to a second terminal of the passive circuit, the passive circuit being coupled in shunt between the first and second test pads and the third and fourth test pads.
25. The semiconductor device of claim 24 , wherein the passive circuit includes:
an inductor formed on the substrate; and
a capacitor formed on the substrate, the inductor and capacitor being electrically connected in series with a first terminal of the capacitor being coupled to a first terminal of the inductor.
26. The semiconductor device of claim 25 , wherein the inductor includes a coiled conductive layer and the capacitor includes first and second conductive layers and an insulating layer disposed between the first and second conductive layers.
27. The semiconductor device of claim 25 , further including:
a first conductive via electrically connecting the first terminal of the inductor to the first terminal of the capacitor;
a second conductive via electrically connecting a second terminal of the inductor to the first and second test pads; and
a third conductive via electrically connecting a second terminal of the capacitor to the third and fourth test pads.
28. The semiconductor device of claim 24 , wherein an electrical characteristic of the passive circuit is tested using test probes to perform a two-port shunt measurement by applying a first voltage across the first and third test pads and applying a second voltage across the second and fourth test pads such that a first current flows through the first and third test pads and a second current flows through the second and fourth test pads.
29. The semiconductor device of claim 28 , wherein the shunt measurement negates series resistance of the test probes when determining the electrical characteristic of the passive circuit.
30. The semiconductor device of claim 29 , wherein the electrical characteristic is resonant frequency or quality factor.