Integrated circuit packaging system having dual sided connection and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via and to the substrate;

attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit;

providing a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via;

mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via includes electrically coupling the pre-attached interconnect and the device through via;

forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer; and

connecting a mounting device to the device through via.

2. The method as claimed in claim 1 wherein forming the encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer includes exposing the interposer through via.

3. The method as claimed in claim 1 wherein forming the encapsulation over the substrate covers the integrated circuit, the conductive support, and partially covers the pre-formed interposer.

4. The method as claimed in claim 1 wherein providing the pre-formed interposer, having the interposer through via and the pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via includes providing the pre-formed interposer having a pre-attached solder on pad bump.

5. A method of manufacture of an integrated circuit packaging system comprising:

mounting a flip chip integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via and to the substrate;

attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit;

providing a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via;

mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via includes electrically coupling the pre-attached interconnect and the device through via;

forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer; and

connecting a mounting device to the device through via.

6. The method as claimed in claim 5 wherein providing the pre-formed interposer includes providing an organic interposer.

7. An integrated circuit packaging system comprising:

a substrate;

an integrated circuit, having a device through via and a device interconnect, over the substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via and to the substrate;

a conductive support over the substrate with the conductive support adjacent to the integrated circuit;

a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via including:

the pre-formed interposer having the characteristics of the pre-attached interconnect pre-attached to a carrier of the pre-formed interposer, and

the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via;

an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer; and

a mounting device connected to the device through via.

8. The system as claimed in claim 7 wherein the pre-attached interconnect is electrically coupled to the device through via.

9. The system as claimed in claim 7 wherein the encapsulation exposes the interposer through via.

10. The system as claimed in claim 7 wherein the pre-attached interconnect includes a pre-attached solder on pad bump.

11. The system as claimed in claim 7 wherein the pre-formed interposer is electrically coupled to the conductive support.

12. The system as claimed in claim 7 wherein the pre-formed interposer includes an organic interposer.

13. The system as claimed in claim 7 wherein the integrated circuit includes a flip chip.