IP Library › Granted Patent US 7,923,822
Granted Patent B2
US 7,923,822 · App. 12/762,602 · Granted Apr 12, 2011

Integrated circuit package system including shield

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Quick Facts
Patent No.
US 7,923,822
App. No.
12/762,602
Filed
Apr 19, 2010
Granted
Apr 12, 2011
Kind
B2
Art Unit
2891
USPC
257/659
Abstract

An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.

Claims (24)

1. An integrated circuit package system comprising:

a substrate;

a first device attached to the substrate;

a shield attached to the substrate and surrounding the first device, the shield having a projection over a lower side wall with an aperture between the projection and the lower side wall; and

an encapsulation material through the aperture.

2. The system as claimed in claim 1 wherein:

the apertures facilitate dispersion of an encapsulation material.

3. The system as claimed in claim 1 wherein:

the projection of the shield is folded outward.

4. The system as claimed in claim 1 wherein:

the shield includes flanges bent upwards to block electromagnetic energy.

5. The system as claimed in claim 1 wherein:

the shield includes a collar shield to block electromagnetic energy.

6. The system as claimed in claim 1 wherein:

the shield includes a top and sidewalls; and

the apertures are formed within the sidewalls.

7. The system as claimed in claim 1 wherein:

the shield blocks electromagnetic energy by overlapping parts of the shield.

8. The system as claimed in claim 1 further comprising:

a second device formed over the first device, the second device supported by the shield.

9. The system as claimed in claim 1 wherein:

the first device is selected from semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.

10. The system as claimed in claim 8 wherein:

the second device is selected from semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.