IP Library › Granted Patent US 7,977,778
Granted Patent B2
US 7,977,778 · App. 11/744,697 · Granted Jul 12, 2011

Integrated circuit package system with interference-fit feature

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Quick Facts
Patent No.
US 7,977,778
App. No.
11/744,697
Filed
May 4, 2007
Granted
Jul 12, 2011
Kind
B2
Art Unit
2822
USPC
257/678
Abstract

An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and the integrated circuit die, and encapsulating the integrated circuit die.

Claims (42)

1. A method for manufacturing an integrated circuit package system comprising:

forming an integrated circuit die;

forming an interference-fit feature in the integrated circuit die;

forming a paddle having a support element and a tie bar;

fitting the support element within the interference-fit feature;

connecting an external interconnect and the integrated circuit die; and

encapsulating the integrated circuit die.

2. The method as claimed in claim 1 wherein forming the paddle includes forming the paddle having a gap between a perimeter portion and the support element.

3. The method as claimed in claim 1 wherein forming the interference-fit feature includes forming a recess in a non-active side of the integrated circuit die.

4. The method as claimed in claim 1 further comprising forming the support element adjacent to the external interconnect.

5. The method as claimed in claim 1 further comprising forming the support element having a planar portion and a locking portion.

6. A method for manufacturing an integrated circuit package system comprising:

forming an integrated circuit die having a non-active side and an active side;

forming an interference-fit feature in the integrated circuit die from the non-active side;

forming a paddle having a support element and a tie bar;

fitting the support element within the interference-fit feature without an adhesive;

connecting an external interconnect and the active side; and

encapsulating the integrated circuit die.

7. The method as claimed in claim 6 wherein forming the paddle includes forming a perimeter portion and a slot through the paddle.

8. The method as claimed in claim 6 further comprising:

forming the support element having a planar portion and a locking portion; and wherein forming the locking portion includes:

forming a slot through the locking portion.

9. The method as claimed in claim 6 further comprising:

forming the support element having a planar portion and a locking portion; and wherein forming the locking portion includes:

forming a tip and a base extending from the planar portion.

10. The method as claimed in claim 6 wherein fitting the support element within the interference-fit feature further includes mounting the integrated circuit die over the support element.

11. An integrated circuit package system comprising:

an integrated circuit die having an interference-fit feature;

a paddle having a support element and a tie bar extending from a corner of the paddle and with the support element within the interference-fit feature;

an external interconnect connected with the integrated circuit die; and

an encapsulation over the integrated circuit die.

12. The system as claimed in claim 11 wherein the paddle includes a gap between a perimeter portion and the support element.

13. The system as claimed in claim 11 wherein the interference-fit feature includes a recess in a non-active side of the integrated circuit die.

14. The system as claimed in claim 11 wherein the support element is adjacent to the external interconnect.

15. The system as claimed in claim 11 wherein the support element includes a planar portion and a locking portion.

16. The system as claimed in claim 11 wherein:

the integrated circuit die includes a non-active side and an active side with the interference-fit feature from the non-active side; and

the encapsulation is partially over the support element.

17. The system as claimed in claim 16 wherein the support element includes the paddle having a slot.

18. The system as claimed in claim 16 wherein the support element includes a planar portion and a locking portion having a slot.

19. The system as claimed in claim 16 wherein the support element includes a planar portion and a locking portion with the locking portion having a tip and a base extending from the planar portion.

20. The system as claimed in claim 16 wherein the support element within the interference-fit feature includes the integrated circuit die over the support element.