IP Library › Granted Patent US 8,022,531
Granted Patent B2
US 8,022,531 · App. 12/880,415 · Granted Sep 20, 2011

Integrated circuit package system using heat slug

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Quick Facts
Patent No.
US 8,022,531
App. No.
12/880,415
Filed
Sep 13, 2010
Granted
Sep 20, 2011
Kind
B2
Examiner
CHU, CHRIS C
Art Unit
2815
USPC
257/706
Abstract

An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

Claims (29)

1. An integrated circuit package system comprising:

a substrate having an integrated circuit die thereon;

a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug and a distance between a bottom surface of the tie bars and a bottom surface of the heat slug being equal to a distance between a top surface of the tie bars and a top surface of the heat slug; and

an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

2. The integrated circuit package system as claimed in claim 1 , wherein the heat slug, further comprises:

a main body portion and a tie bar substantially centrally located along each side of the main body portion.

3. The integrated circuit package system as claimed in claim 1 , wherein the heat slug, further comprises:

a heat slug having a main body portion and a tie bar having a thickness of greater than about half the thickness of the main body portion.

4. The integrated circuit package system as claimed in claim 1 , wherein the heat slug, further comprises:

upper and lower surfaces; and

a tie bar located at least one of flush with the upper surface of the heat slug, flush with the lower surface of the heat slug, and intermediate the upper and lower surfaces of the heat slug.

5. The integrated circuit package system as claimed in claim 1 , wherein the heat slug, further comprises:

a main body portion and a pair of tie bars located along each side of the main body portion.

6. The integrated circuit package system as claimed in claim 1 , further comprising:

a plurality of contacts on the substrate;

wires bonding the integrated circuit die to the contacts;

a heat slug having a plurality of tie bars slug and a distance between a bottom surface of the tie bars and a bottom surface of the heat slug being canal to a distance between a top surface of the tie bars and a top surface of the heat slug; and

an encapsulant encapsulating the substrate and the integrated circuit with an encapsulant, the encapsulant in contact with the heat slug.

7. The integrated circuit package system as claimed in claim 6 , wherein the heat slug, further comprises:

a main body portion; wherein:

each of the plurality of tie bars is substantially centrally located along each side of the main body portion.

8. The integrated circuit package system as claimed in claim 6 , wherein the heat slug, further comprises:

a main body portion; and

the plurality of tie bars having a thickness of greater than about half the thickness of the main body portion.

9. The integrated circuit package system as claimed in claim 6 , wherein the heat slug, further comprises:

upper and lower surfaces; and wherein:

the plurality of tie bars is located at least one of flush with the upper surface of the heat slug, flush with the lower surface of the heat slug, and intermediate the upper and lower surfaces of the heat slug.

10. The integrated circuit package system as claimed in claim 6 , wherein the heat slug, further comprises:

a main body portion and a pair of tie bars located along each side of the main body portion.