Integrated circuit package with top pad

1. A method of manufacturing an integrated circuit package system comprising:

forming a bottom pad with bottom tie bars having bottom tie bar ends, wherein the bottom tie bars are arranged symmetrically around the bottom pad;

attaching an integrated circuit die over the bottom pad;

attaching a top pad with top tie bars having tie bar ends, over the integrated circuit die, wherein the top tie bars are arranged symmetrically around the top pad and in reference to the bottom pad; and

applying an encapsulant wherein the top tie bars and the bottom tie bars are exposed on a side of the encapsulant for forming package leads with the tie bar ends parallel to, aligned laterally to, and electrically isolated from the bottom tie bar ends extending beyond the encapsulant including shaping the tie bar ends and the bottom tie bar ends for providing coplanar contacts adjacent to a bottom lead end.

2. The method as claimed in claim 1 wherein forming the bottom pad includes forming a deep down set pad.

3. The method as claimed in claim 1 wherein attaching the top pad includes forming the tie bar ends and bottom tie bar ends parallel to the bottom lead ends.

4. The method as claimed in claim 1 wherein attaching the integrated circuit die includes applying an attach layer over the integrated circuit die.

5. The method as claimed in claim 1 wherein attaching the integrated circuit die includes attaching a second integrated circuit die over the integrated circuit die.

6. A method of manufacturing an integrated circuit package system comprising:

forming a bottom assembly having a bottom pad with bottom tie bars having bottom tie bar ends, wherein the bottom tie bars are arranged symmetrically around the bottom pad;

mounting an integrated circuit die over the bottom pad in the bottom assembly;

forming a top assembly incorporating a top pad with top tie bars having tie bar ends, wherein the top tie bars are arranged symmetrically around the top pad;

mounting the top assembly over the integrated circuit die placing the top tie bars near the bottom tie bars; and

forming an encapsulant wherein the top tie bars, integral to the top pad, and the bottom tie bars are exposed on a side of the encapsulant with the tie bar ends parallel to, aligned laterally to, and electrically isolated from the bottom tie bar ends extending beyond the encapsulant for forming package leads including shaping the tie bar ends and the bottom tie bar ends for providing coplanar contacts adjacent to a bottom lead end.

7. The method as claimed in claim 6 wherein forming the bottom assembly includes forming a deep down set pad for heat conduction.

8. The method as claimed in claim 6 wherein mounting the top assembly includes forming the tie bar ends and bottom tie bar ends parallel to the bottom lead ends.

9. The method as claimed in claim 6 wherein forming the encapsulant includes forming the encapsulant with the bottom pad and the top pad partially exposed.

10. The method as claimed in claim 6 wherein mounting the top assembly over the integrated circuit die includes attaching a second integrated circuit die under the top pad prior to mounting the top assembly over the integrated circuit die.

11. An integrated circuit package system comprising:

a bottom pad with bottom tie bars having bottom tie bar ends, wherein the bottom tie bars are arranged symmetrically around the bottom pad;

an integrated circuit die attached over the bottom pad;

a top pad with top tie bars having tie bar ends, attached over the integrated circuit die, wherein the top tie bars are arranged symmetrically around the top pad and in reference to the bottom pad; and

an encapsulant formed on the integrated circuit die, the top pad and the bottom pad includes the top tie bar ends, integral to the top pad, and the bottom tie bar ends are exposed on a side of the encapsulant with the top tie bar ends parallel to, aligned laterally to, and electrically isolated from the bottom tie bar ends extending beyond the encapsulant and shaped for providing coplanar contacts adjacent to a bottom lead end.

12. The system as claimed in claim 11 wherein the bottom pad is a deep down set pad.

13. The system as claimed in claim 11 wherein the top pad attached over the integrated circuit die includes the tie bar ends and bottom tie bar ends parallel to the bottom lead ends.

14. The system as claimed in claim 11 wherein the integrated circuit die includes an attach layer over the integrated circuit die.

15. The system as claimed in claim 11 wherein the integrated circuit die includes a second integrated circuit die over the integrated circuit die.

16. The system as claimed in claim 11 wherein:

the bottom pad with the bottom tie bars are part of a bottom assembly;

the top pad with the top tie bars are part of a top assembly; and

the top tie bars are located near the bottom tie bars to include coplanar contacts formed by the tie bar ends and the bottom tie bar ends.

17. The system as claimed in claim 16 wherein the bottom assembly includes a deep down set pad for heat conduction.

18. The system as claimed in claim 16 wherein the top tie bars are located over the bottom tie bars.

19. The system as claimed in claim 16 wherein the encapsulant leaves the bottom pad and the top pad partially exposed.

20. The system as claimed in claim 16 wherein the top assembly includes a second integrated circuit attached under the top pad.