Bridge stack integrated circuit package-on-package system

1. A method of manufacturing a bridge stack integrated circuit package-on-package system comprising:

forming a first integrated circuit package system having a first integrated circuit die over a first substrate;

forming a second integrated circuit package system having a second integrated circuit die over a second substrate;

forming a bridge integrated circuit package system having a bridge interconnect; and

mounting the bridge integrated circuit package system on the first substrate and on the second substrate and directly attaching the bridge interconnect to the first substrate and an another bridge interconnect to the second substrate, the bridge integrated circuit package system and the bridge interconnect and the another bridge interconnect border a separation and have no structures therebetween, and the separation is between the first integrated circuit package system and the second integrated circuit package system.

2. The method as claimed in claim 1 wherein mounting the bridge integrated circuit package system includes overhanging the bridge integrated circuit package system over the first integrated circuit package system.

3. The method as claimed in claim 1 wherein mounting the bridge integrated circuit package system on the first substrate includes mounting the bridge integrated circuit package system over the first integrated circuit package system.

4. The method as claimed in claim 1 wherein forming the first integrated circuit package system includes attaching a first external interconnect on a first bottom contact of the first substrate.

5. The method as claimed in claim 1 wherein forming the bridge integrated circuit package system includes forming a package encapsulation.

6. A bridge stack integrated circuit package-on-package system comprising:

a first integrated circuit package system having a first integrated circuit die over a first substrate;

a second integrated circuit package system having a second integrated circuit die over a second substrate; and

a bridge integrated circuit package system on the first substrate and on the second substrate includes a bridge interconnect attached directly to the first substrate and an another bridge interconnect attached directly to the second substrate, the bridge interconnect and the another bridge interconnect border a separation and have no structures therebetween, and the separation is between the first integrated circuit package system and the second integrated circuit package system.

7. The system as claimed in claim 6 wherein the first integrated circuit package system includes a first encapsulation over the first substrate in an offset configuration.

8. The system as claimed in claim 6 wherein the bridge integrated circuit package system includes a first bridge interconnect with a first height and a second bridge interconnect with a second height such that the second height is not equal to the first height.

9. The system as claimed in claim 6 wherein the bridge integrated circuit package system includes:

a bridge substrate having an opening; and

a planar structure over the bridge substrate.

10. The system as claimed in claim 6 wherein the first integrated circuit package system includes a flip chip over the first substrate.

11. The system as claimed in claim 6 wherein the bridge integrated circuit package system includes a first overhang over the first integrated circuit package system.

12. The system as claimed in claim 6 wherein the bridge integrated circuit package system on the first substrate includes the bridge integrated circuit package system over the first integrated circuit package system.

13. The system as claimed in claim 6 wherein the first integrated circuit package system includes a first external interconnect on a first bottom contact of the first substrate.

14. The system as claimed in claim 6 wherein the bridge integrated circuit package system includes a package encapsulation.