IP Library › Granted Patent US 8,207,597

Granted Patent B2

US 8,207,597 · App. 11/670,899 · Granted Jun 26, 2012

Integrated circuit package system with flashless leads

View Patent ↗

Loading inventors, assignments & file history…

Monitor This Case

Get email alerts when status or documents change.

Order Certified Copies

Most orders are placed with the USPTO same day — all within 24 business hours.

Order via The Patent Place →

Pre-filled with this patent's details

Quick Facts

Patent No.: US 8,207,597
App. No.: 11/670,899
Filed: Feb 2, 2007
Granted: Jun 26, 2012
Kind: B2
Examiner: GUMEDZOE, PENIEL M
Art Unit: 2891
USPC: 257/666

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.

Claims (70)

1. A method of manufacture of an integrated circuit package system comprising:

forming a lead frame including:

forming an inner lead and an outer lead having planar surfaces and extending inwardly in the lead frame with:

the inner lead having a planar surface width broader at an inner end portion inward in the lead frame and the outer lead having a consistent planar surface width or

the outer lead having a planar surface width broader at the outer end portion inward in the lead frame and the inner lead having a planar surface width narrower between the inner end portion inward in the lead frame and an inner bottom portion outward in the lead frame;

forming a protrusion in a slot adjacent to the inner lead;

encapsulating an integrated circuit die electrically connected to the inner lead with the inner end portion inward in the lead frame exposed by a cavity in a mold chase and to the outer lead with the outer end portion inward in the lead frame exposed by a cavity in a mold chase; and

singulating the outer lead and the inner lead from the lead frame.

2. The method as claimed in claim 1 further comprising forming a stiffening structure integral with the lead frame including forming an inner lead body of the inner lead.

3. The method as claimed in claim 1 wherein forming the lead frame includes:

forming a dam bar between the slot and the inner lead; and

forming a stiffening structure integral with the lead frame including:

forming the dam bar by having the slot further away from the inner lead.

4. The method as claimed in claim 1 further comprising:

forming the outer lead adjacent to the inner lead; and

wherein forming a stiffening structure integral with the lead frame includes:

forming a dam bar between the slot and the outer lead.

5. The method as claimed in claim 1 wherein singulating the inner lead from the lead frame includes:

singulating a stiffening structure from the integrated circuit package system.

6. The method as claimed in claim 1 further comprising forming a stiffening structure integral with the lead frame including:

forming a first inner lead body of the inner lead and a second inner lead body of the inner lead with an inner lead tip between the first inner lead body and the second inner lead body, the second inner lead body and the first inner lead body having the same width and a reduced width of the inner lead tip in between.

7. The method as claimed in claim 1 further comprising:

forming an outer lead, having an outer lead body, adjacent to the inner lead; and

encapsulating the outer lead with the outer lead body exposed.

8. The method as claimed in claim 1 wherein forming the inner lead includes:

half etching the inner lead for forming an inner lead tip and a first inner lead body.

9. The method as claimed in claim 1 wherein forming the inner lead includes:

half etching the inner lead for forming an inner lead tip between a first inner lead body and a second inner lead body.

10. A method of manufacture of an integrated circuit package system comprising:

forming a lead frame including:

forming an inner lead and an outer lead having planar surfaces and the inner lead and the outer lead extending inwardly in the lead frame with:

the inner lead having a planar surface width broader at an inner end portion inward in the lead frame and the outer lead having a consistent planar surface width or

forming a protrusion in a slot adjacent to the inner lead; and

forming a stiffening structure integral with the lead frame for maintaining the planar surface;

connecting an integrated circuit die with the inner lead and the outer lead;

encapsulating the inner lead and the outer lead with a first inner lead body of the inner lead and the outer lead exposed by a cavity in a mold chase; and

singulating the inner lead and the outer lead from the lead frame.

11. The method as claimed in claim 10 wherein:

forming the lead frame includes:

forming a dam bar between the slot and both the inner lead as well as the outer lead; and

forming the stiffening structure integral with the lead frame includes:

forming the dam bar by having the slot further away from the end away from the lead frame of the inner lead.

12. The method as claimed in claim 10 wherein forming the stiffening structure integral with the lead frame includes:

forming a second inner lead body of the inner lead with an inner lead tip between the first inner lead body and the second inner lead body, the second inner lead body and the first inner lead body having the same width and a reduced width of the inner lead tip in between;

forming a dam bar between the slot and both the inner lead and the outer lead; and

forming a protrusion in the slot adjacent to the inner lead.

13. The method as claimed in claim 10 wherein forming the stiffening structure integral with the lead frame includes:

forming a second inner lead body of the inner lead with an inner lead tip between the first inner lead body and the second inner lead body, the second inner lead body having a width wider than that of the inner lead tip; and

forming a dam bar between the slot and the outer lead.

14. The method as claimed in claim 10 wherein forming the stiffening structure integral with the lead frame includes:

forming an outer lead body from the outer lead and an outer lead tip outwardly adjacent to the outer lead body.

15. The method as claimed in claim 10 wherein:

forming the stiffening structure integral with the lead frame includes:

forming a second inner lead body of the inner lead with an inner lead tip between the first inner lead body and the second inner lead body; and

encapsulating the inner lead further includes:

encapsulating the inner lead tip.

16. The method as claimed in claim 10 wherein

forming the outer lead includes:

forming an outer lead tip and an outer lead body from the outer lead; and

encapsulating the outer lead further includes:

encapsulating the outer lead tip.

17. The method as claimed in claim 10 wherein forming the stiffening structure integral with the lead frame includes:

forming a second inner lead body of the inner lead with an inner lead tip between the first inner lead body and the second inner lead body, the second inner lead body having a width substantially the same as that of the inner lead tip;

forming an outer lead body from the outer lead and an outer lead tip outwardly adjacent to the outer lead body; and

forming a dam bar between the slot and the outer lead.

18. The method as claimed in claim 10 wherein forming the outer lead includes:

half etching the outer lead for forming an outer lead tip and an outer lead body.

19. The method as claimed in claim 10 further comprising encapsulating the integrated circuit die.