Integrated circuit package system with encapsulating features
View Patent ↗An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
1. A method of manufacture of an integrated circuit package system comprising:
forming a lead frame having a mold gate comprising:
providing a first surface having a first opening, and
providing a second surface having a second opening and opposite the first surface; and
forming angled gate sides having the second opening larger than the first opening, the angled gate sides facing each other in the mold gate between the first surface and the second surface and with each of the angled gate sides including a horizontal portion facing the second opening.
2. The method as claimed in claim 1 wherein forming the lead frame includes forming a tie bar in the mold gate.
3. The method as claimed in claim 1 wherein forming the angled gate sides facing each other in the mold gate includes half-etching the lead frame from the second surface for forming the angled gate sides.
4. The method as claimed in claim 1 further comprising:
connecting an integrated circuit die and the lead frame; and
encapsulating the integrated circuit die through the mold gate.
5. The method as claimed in claim 1 wherein forming the lead frame includes forming an inner lead and an outer lead.
6. A method of manufacture of an integrated circuit package system comprising: forming a lead frame having a mold gate comprising:
forming a tie bar in the mold gate,
providing a first surface having a first opening, and
providing a second surface having a second opening and opposite the first surface;
connecting an integrated circuit die and the lead frame;
forming angled gate sides having the second opening larger than the first opening, the angled gate sides facing each other in the mold gate between the first surface and the second surface and with each of the angled gate sides including a horizontal portion facing the second opening; and
encapsulating the integrated circuit die through the mold gate.
7. The method as claimed in claim 6 further comprising singulating portions of the lead frame.
8. The method as claimed in claim 6 wherein forming the angled gate sides facing each other in the mold gate includes half-etching the lead frame from the second surface for forming the angled gate sides.
9. The method as claimed in claim 6 wherein forming the lead frame having the tie bar includes half-etching the tie bar.
10. The method as claimed in claim 6 wherein connecting the integrated circuit die and the lead frame includes connecting an external interconnect of the lead frame and the integrated circuit die.
11. An integrated circuit package system comprising: a lead frame having a mold gate comprising:
a first surface having a first opening,
a second surface having a second opening and opposite the first surface, and
wherein: the mold gate having angled gate sides having the second opening larger than the first opening, the angled gate sides facing each other between the first surface and the second surface and with each of the angled gate sides including a horizontal portion facing the second opening.
12. The system as claimed in claim 11 wherein the lead frame includes a tie bar in the mold gate.
13. The system as claimed in claim 11 wherein the lead frame having the mold gate includes the angled gate sides in a stepped configuration from the second surface.
14. The system as claimed in claim 11 further comprising:
an interconnect between an integrated circuit die and the lead frame; and
an encapsulation over the integrated circuit die through the mold gate.
15. The system as claimed in claim 11 wherein the lead frame includes an inner lead and an outer lead.
16. The system as claimed in claim 11 wherein:
the lead frame includes a tie bar in the mold gate; and
further comprising:
an interconnect between an integrated circuit die and the lead frame; and
an encapsulation over the integrated circuit die through the mold gate.
17. The system as claimed in claim 16 wherein the integrated circuit package system includes only portions of the lead frame within a singulation outline.
18. The system as claimed in claim 16 wherein the lead frame having the mold gate includes the angled gate sides in a stepped configuration.
19. The system as claimed in claim 16 wherein the lead frame having the tie bar includes the tie bar above the second surface.
20. The system as claimed in claim 16 further comprising an external interconnect of the lead frame connected with the integrated circuit die.