IP Library › Granted Patent US 8,263,435
Granted Patent B2
US 8,263,435 · App. 12/914,895 · Granted Sep 11, 2012

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

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Quick Facts
Patent No.
US 8,263,435
App. No.
12/914,895
Filed
Oct 28, 2010
Granted
Sep 11, 2012
Kind
B2
Art Unit
2812
USPC
438/109
Abstract

A semiconductor wafer contains a plurality of first semiconductor die. The semiconductor wafer is mounted to a carrier. A channel is formed through the semiconductor wafer to separate the first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. An encapsulant is deposited over the carrier and first semiconductor die and into the channel while a side portion and surface portion of the second semiconductor die remain exposed from the encapsulant. A first conductive via is formed through the encapsulant in the channel. A second conductive via is formed through the encapsulant over a contact pad of the first semiconductor die. A conductive layer is formed over the encapsulant between the first and second conductive vias. An insulating layer is formed over the conductive layer and encapsulant. The carrier is removed. An interconnect structure is formed over the first conductive via.

Claims (81)

1. A method of making a semiconductor device, comprising:

providing a semiconductor wafer containing a plurality of first semiconductor die;

mounting the semiconductor wafer to a carrier;

forming a channel through the semiconductor wafer to separate the first semiconductor die;

mounting a second semiconductor die over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die;

depositing an encapsulant over the carrier and first semiconductor die and into the channel while a side portion and surface portion of the second semiconductor die opposite the first semiconductor die remain exposed from the encapsulant;

forming a conductive via through the encapsulant;

forming a conductive layer over the encapsulant electrically connected to the conductive via;

forming an insulating layer over the conductive layer and encapsulant;

removing the carrier; and

forming an interconnect structure over the conductive via.

2. The method of claim 1 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

disposing the carrier and first and second semiconductor die in a chase mold; and

dispensing the encapsulant into the chase mold to cover the carrier and first semiconductor die while the side portion and surface portion of the second semiconductor die remain exposed from the encapsulant.

3. The method of claim 1 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

disposing the carrier and first and second semiconductor die in a chase mold;

placing a mold film over the carrier and first and second semiconductor die; and

compressing the chase mold to form the mold film over the carrier and first semiconductor die while the side portion and surface portion of the second semiconductor die remain exposed from the encapsulant.

4. The method of claim 1 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

forming a dam around the carrier and first and second semiconductor die; and

dispensing the encapsulant into the dam to cover the carrier and first semiconductor die while the side portion and surface portion of the second semiconductor die remain exposed from the encapsulant.

5. The method of claim 1 , further including mounting a third semiconductor die over the second semiconductor die.

6. The method of claim 1 , further including singulating the first semiconductor die and second semiconductor die through the encapsulant.

7. A method of making a semiconductor device, comprising:

providing a semiconductor wafer containing a plurality of first semiconductor die;

mounting the semiconductor wafer to a carrier;

forming a channel through the semiconductor wafer to separate the first semiconductor die;

mounting a second semiconductor die over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die;

depositing an encapsulant over the carrier and first semiconductor die and into the channel;

forming a conductive via through the encapsulant; and

forming a first conductive layer over the encapsulant electrically connected to the conductive via.

8. The method of claim 7 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

disposing the carrier and first and second semiconductor die in a chase mold; and

dispensing the encapsulant into the chase mold to cover the carrier and first semiconductor die.

9. The method of claim 7 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

disposing the carrier and first and second semiconductor die in a chase mold;

placing a mold film over the carrier and first and second semiconductor die; and

compressing the chase mold to form the mold film over the carrier and first semiconductor die.

10. The method of claim 7 , wherein depositing the encapsulant over the carrier and first semiconductor die includes:

forming a dam around the carrier and first and second semiconductor die; and

dispensing the encapsulant into the dam to cover the carrier and first semiconductor die.

11. The method of claim 7 , further including forming a heat spreader over the first semiconductor die or second semiconductor die.

12. The method of claim 7 , further including depositing the encapsulant co-planar with a surface of the second semiconductor die opposite the first semiconductor die.

13. The method of claim 7 , further including forming a second conductive layer over the first semiconductor die.

14. A method of making a semiconductor device, comprising:

providing a first semiconductor die;

mounting a second semiconductor die over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die;

depositing a first encapsulant over and around the first semiconductor die;

forming a first conductive via through the first encapsulant around the first semiconductor die; and

forming a second conductive via through the first encapsulant over a contact pad of the first semiconductor die.

15. The method of claim 14 , further including:

forming a conductive layer over the first encapsulant between the first and second conductive vias; and

forming an insulating layer over the first encapsulant and conductive layer.

16. The method of claim 14 , wherein a side portion and surface portion of the second semiconductor die opposite the first semiconductor die remain exposed from the first encapsulant.

17. The method of claim 14 , wherein the first encapsulant is co-planar with a surface portion of the second semiconductor die opposite the first semiconductor die.

18. The method of claim 14 , further including:

mounting a third semiconductor die to a substrate;

mounting the third semiconductor die and substrate to the second semiconductor die; and

depositing a second encapsulant over the third semiconductor die and substrate.

19. The method of claim 14 , further including:

mounting the second semiconductor die to a substrate;

mounting the second semiconductor die and substrate to the first semiconductor die; and

depositing a second encapsulant over the second semiconductor die and substrate.

20. The method of claim 14 , further including:

stacking a plurality of semiconductor devices; and

electrically connecting the stacked semiconductor devices through the first and second conductive vias.

21. A method of making a semiconductor device, comprising:

providing a first semiconductor die;

mounting a second semiconductor die over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die;

depositing a first encapsulant over and around the first semiconductor die; and

forming a first conductive via through the first encapsulant.

22. The method of claim 21 , further including:

forming a second conductive via through the first encapsulant over a contact pad of the first semiconductor die;

forming a conductive layer over the first encapsulant between the first and second conductive vias; and

forming an insulating layer over the first encapsulant and conductive layer.

23. The method of claim 21 , wherein a side portion and surface portion of the second semiconductor die opposite the first semiconductor die remain exposed from the first encapsulant.

24. The method of claim 21 , wherein the first encapsulant is co-planar with a surface portion of the second semiconductor die opposite the first semiconductor die.

25. The method of claim 21 , further including:

mounting a third semiconductor die to a substrate;

mounting the third semiconductor die and substrate to the second semiconductor die; and

depositing a second encapsulant over the third semiconductor die and substrate.