Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.
1. A method for manufacturing an integrated circuit package system comprising:
providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and
mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect and including a flip integrated circuit or a flip chip component.
2. The method as claimed in claim 1 wherein:
mounting the offset package includes forming a first portion over the first integrated circuit and a second portion overhanging the base substrate.
3. A method for manufacturing an integrated circuit package system comprising:
providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and
mounting a first portion of an offset package over the first integrated circuit and a second portion of the offset package overhanging the base substrate, the second portion coupled to the base substrate and the offset package including a flip integrated circuit or a flip chip component.
4. The method as claimed in claim 3 wherein:
providing the first integrated circuit coupled to the base substrate by an electrical interconnect formed on one side includes utilizing lead-in-film structures.
5. The method as claimed in claim 3 wherein:
coupling the second portion to the base substrate includes using an interposer as a system interconnect.
6. The method as claimed in claim 3 wherein:
mounting the offset package includes positioning the offset package to overhang one or more sides of the first integrated circuit.
7. The method as claimed in claim 3 further comprising:
mounting a passive component, an active component, or a combination thereof on the base substrate.
8. An integrated circuit package system comprising:
a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect on one side; and
an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect and including a flip integrated circuit or a flip chip component.
9. The system as claimed in claim 8 further comprising:
a base package body over the electrical interconnect and a portion of the first integrated circuit and the base substrate.
10. The system as claimed in claim 8 further comprising:
a system package body over the electrical interconnect and around a portion of the offset package.
11. The system as claimed in claim 8 wherein:
the offset package includes a first portion on the first integrated circuit and a second portion overhanging the base substrate.
12. The system as claimed in claim 8 wherein:
the system interconnect includes a solder ball structure.
13. The system as claimed in claim 8 wherein:
the electrical interconnect includes a lead-in-film structure.
14. The system as claimed in claim 8 wherein:
the system interconnect includes an interposer.
15. The system as claimed in claim 8 further comprising:
a passive component, an active component, or a combination thereof on the base substrate.