IP Library › Granted Patent US 8,422,243
Granted Patent B2
US 8,422,243 · App. 11/610,401 · Granted Apr 16, 2013

Integrated circuit package system employing a support structure with a recess

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Quick Facts
Patent No.
US 8,422,243
App. No.
11/610,401
Filed
Dec 13, 2006
Granted
Apr 16, 2013
Kind
B2
Art Unit
2835
USPC
361/760
Abstract

An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support structure along an outermost periphery thereof, to include a recess for preventing mold bleed, the recess surrounded by the lead finger system; and encapsulating the recess and the electrical interconnect system with an encapsulation material to interlock the encapsulation material.

Claims (25)

1. An integrated circuit package system comprising:

an electrical interconnect system including a support structure and a lead-finger system;

a recess along a top edge of the support structure at an outermost periphery thereof for preventing mold bleed, the recess bounded by a portion of the support structure below the recess and surrounded by the leadfinger system; and

an encapsulation material encapsulating the recess and the electrical interconnect system to interlock the encapsulation material.

2. The system as claimed in claim 1 wherein:

the recess includes an s-shaped configuration.

3. The system as claimed in claim 1 wherein:

the recess includes a step shaped configuration with a first low resistivity interface.

4. The system as claimed in claim 1 wherein:

the support structure includes a ground ring.

5. The system as claimed in claim 1 further comprising:

a ground structure within the recess.

6. The system as claimed in claim 1 further comprising:

a device over the support structure;

the device connected to the lead-finger system; and

a support structure bottom side exposed for thermal dissipation.

7. The system as claimed in claim 6 further comprising:

the device connected to a ground structure or a ground ring.

8. The system as claimed in claim 1 wherein:

the integrated circuit package system includes a quad flat non-leaded package.

9. The system as claimed in claim 1 wherein:

the lead-finger system includes half-etched leads.

10. The system as claimed in claim 1 further comprising:

a first low resistivity interface over the recess; and

a second low resistivity interface over a ground ring.