Semiconductor device having a plurality of phosphorus-doped silicon carbide layers
View Patent ↗A semiconductor device includes a MOS transistor, a source electrode and a drain electrode on the MOS transistor each include a first carbon doped silicon layer including carbon at a first carbon concentration and phosphorus at a first phosphorus concentration and a second carbon doped silicon layer over the first silicon carbide layer, which includes phosphorus at a second phosphorus concentration higher than the first phosphorus concentration, and which includes carbon at a second carbon concentration less than or equal to the first carbon concentration.
1. A semiconductor device comprising:
a gate insulating film over a semiconductor substrate;
a gate electrode over the gate insulating film;
a channel region in the semiconductor substrate; and
a source electrode and a drain electrode in the semiconductor substrate,
wherein each of the source electrode and the drain electrode includes a first carbon doped silicon layer including carbon at a first carbon concentration and phosphorus at a first phosphorus concentration and a second carbon doped silicon layer over the first carbon doped silicon layer and in contact with the channel region, the second carbon doped silicon layer includes phosphorus at a second phosphorus concentration higher than the first phosphorus concentration and includes carbon at a second carbon concentration less than the first carbon concentration and,
wherein a third carbon doped silicon layer is provided between the second carbon doped silicon layer and a sidewall spacer for the gate electrode and an upper surface of at least a portion of the third carbon doped silicon layer directly underlies the sidewall spacer.
2. The semiconductor device according to claim 1 , wherein the second carbon doped silicon layer is disposed in a pair of first concave portions, located in the semiconductor substrate and sandwiching the channel region, the first carbon doped silicon layer is disposed in second concave portions, which are disposed in the semiconductor substrate and in contact with the first concave portions, and the second concave portions are deeper than the first concave portions.
3. The semiconductor device according to claim 1 , wherein the first carbon concentration is 2.0 atomic percent or more and the second carbon concentration is 1.5 atomic percent or less.
4. The semiconductor device according to claim 1 , wherein the first phosphorus concentration is 1.0 atomic percent or more and the second phosphorus concentration is 2.0 atomic percent or less.
5. The semiconductor device according to claim 1 , wherein an end portion of the second carbon doped silicon layer is nearer to the channel region than is an end portion of the first carbon doped silicon layer.
6. The semiconductor device according to claim 1 further comprising: side wall spacers on side surfaces of the gate electrode.
7. The semiconductor device according to claim 1 , wherein the first carbon doped silicon layer is thicker than the second silicon carbide layer.
8. The semiconductor device according to claim 1 , wherein the third carbon doped silicon layer over the second carbon doped silicon layer, which includes phosphorus at a third phosphorus concentration higher than the first phosphorus concentration, and which includes carbon at a third carbon concentration less than or equal to the first carbon concentration.
9. A semiconductor device comprising:
a gate insulating film over a semiconductor substrate;
a gate electrode over the gate insulating film;
a channel region in the semiconductor substrate; and
a source electrode and a drain electrode in the semiconductor substrate,
wherein each of the source electrode and the drain electrode includes a first carbon doped silicon layer including carbon at a first carbon concentration and phosphorus at a first phosphorus concentration, a second carbon doped silicon layer over the first carbon doped silicon layer and in contact with the channel region, the second carbon doped silicon layer includes phosphorus at a second phosphorus concentration higher than the first phosphorus concentration and includes carbon at a second carbon concentration less than or equal to the first carbon concentration,
wherein the first phosphorus concentration is 1.0 atomic percent or more and the second phosphorus concentration is 2.0 atomic percent or less.
10. A semiconductor device comprising:
a gate insulating film over a semiconductor substrate;
a gate electrode over the gate insulating film;
a channel region in the semiconductor substrate; and
a source electrode and a drain electrode in the semiconductor substrate,
wherein each of the source electrode and the drain electrode includes a first carbon doped silicon layer including carbon at a first carbon concentration and phosphorus at a first phosphorus concentration and a second carbon doped silicon layer over the first carbon doped silicon layer and in contact with the channel region, the second carbon doped silicon layer includes phosphorus at a second phosphorus concentration higher than the first phosphorus concentration and includes carbon at a second carbon concentration less than or equal to the first carbon concentration and,
wherein a third carbon doped silicon layer is provided between the second carbon doped silicon layer and a sidewall spacer for the gate electrode,
wherein the first phosphorus concentration is 1.0 atomic percent or more and the second phosphorus concentration is 2.0 atomic percent or less.