RF module including control IC without the aid of a relay pad
View Patent ↗A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
1. A radio frequency (RF) module including:
a first semiconductor chip in which an amplifier circuit for amplifying an input RF signal and generating an output RF signal is formed,
the amplifier circuit comprising a bipolar transistor having a base, an emitter, and a collector,
the first semiconductor chip having an input pad for inputting the input RF signal, an output pad for outputting the output RF signal, and a first control pad electrically coupled to the amplifier circuit;
a second semiconductor chip in which a control circuit controlling a base current of the bipolar transistor in the amplifier circuit is formed,
the second semiconductor chip having a second control pad electrically coupled to the control circuit;
a wiring board over which the first semiconductor chip and the second semiconductor chip are arranged adjacent to each other,
the wiring board having a plurality of wirings;
a control wire bonded to the first control pad of the first semiconductor chip and the second control pad of the second semiconductor chip,
a control signal of the control circuit controlling the base current being transmitted via the control wire to the bipolar transistor;
an input wire bonded to the input pad of the first semiconductor chip and coupled to one of the plurality of wirings of the wiring board; and
an output wire bonded to the output pad of the first semiconductor chip and coupled to another one of the plurality of wirings of the wiring board,
wherein the input wire overlaps with a first side of the first semiconductor chip in a plan view,
wherein the output wire overlaps with a second side of the first semiconductor chip in a plan view,
wherein the control wire directly connects the first control pad of the first semiconductor chip and the second control pad of the second semiconductor chip without the aid of a relay pad, and
wherein the control wire overlaps with a third side of the first semiconductor chip in a plan view, the third side intersecting the first side and opposing the second side.
2. A radio frequency (RF) module according to claim 1 , wherein
the bipolar transistor of the amplifier circuit is a heterojunction bipolar transistor, and
the control circuit in the second semiconductor chip comprises a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
3. A radio frequency (RF) module according to claim 2 , wherein
the heterojunction bipolar transistor is formed over a substrate of compound semiconductor, and
the MOSFET is formed over a substrate of silicon.
4. A radio frequency (RF) module according to claim 1 , wherein
the amplifier circuit amplifies two or more input signals of different frequency bands, respectively.
5. A radio frequency (RF) module including:
a first semiconductor chip in which an amplifier circuit for amplifying an input RF signal and generating an output RF signal is formed,
the amplifier circuit comprising an input stage bipolar transistor and an output stage bipolar transistor electrically coupled in series each having a base, an emitter, and a collector,
the first semiconductor chip having an input pad electrically coupled to the base of the input stage bipolar transistor, an output pad electrically coupled to the collector of the output stage transistor, and a first control pad electrically coupled to the amplifier circuit,
a second semiconductor chip in which a control circuit controlling a base current of each of the input stage bipolar transistor and the output stage bipolar transistor is formed,
the second semiconductor chip having a second control pad electrically coupled to the control circuit;
a wiring board over which the first semiconductor chip and the second semiconductor chip are arranged adjacent to each other,
the wiring board having a plurality of wirings;
a control wire bonded to the first control pad of the first semiconductor chip and the second control pad of the second semiconductor chip,
a control signal of the control circuit controlling the base current of the input stage bipolar transistor or the output stage bipolar transistor being transmitted via the control wire;
an input wire bonded to the input pad of the first semiconductor chip and coupled to one of the plurality of wirings of the wiring board; and
an output wire bonded to the output pad of the first semiconductor chip and coupled to another one of the plurality of wirings of the wiring board,
wherein the input wire overlaps with a first side of the first semiconductor chip in a plan view,
wherein the output wire overlaps with a second side of the first semiconductor chip in a plan view,
wherein the control wire directly connects the first control pad of the first semiconductor chip and the second control pad of the second semiconductor chip without the aid of a relay pad, and
wherein the control wire overlaps with a third side of the first semiconductor chip in a plan view, the third side intersecting the first side and opposing the second side.
6. A radio frequency (RF) module according to claim 5 , wherein
each of the input stage bipolar transistor and the output stage bipolar transistor is a heterojunction bipolar transistor, and
the control circuit in the second semiconductor chip comprises a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
7. A radio frequency (RF) module according to claim 6 , wherein
the heterojunction bipolar transistor is formed over a substrate of compound semiconductor, and
the MOSFET is formed over a substrate of silicon.
8. A radio frequency (RF) module according to claim 5 , wherein
the amplifier circuit amplifies two or more input signals of different frequency bands, respectively.
9. A radio frequency (RF) module including:
a first semiconductor chip in which an amplifier circuit for amplifying an input RF signal and generating an output RF signal is formed,
the amplifier circuit comprising a bipolar transistor having a base, an emitter, and a collector,
the first semiconductor chip having a first bonding pad electrically coupled to the amplifier circuit, a second bonding pad for inputting the input RF signal, and a third bonding pad for outputting the output RF signal;
a second semiconductor chip in which a control circuit controlling a base current of the bipolar transistor in the amplifier circuit is formed,
the second semiconductor chip having a fourth bonding pad electrically coupled to the control circuit;
a wiring board over which the first semiconductor chip and the second semiconductor chip are arranged adjacent to each other,
the wiring board having a plurality of wirings;
a first bonding wire bonded to the first bonding pad of the first semiconductor chip and the fourth bonding pad of the second semiconductor chip;
a second bonding wire bonded to the second bonding pad of the first semiconductor chip and coupled to one of the plurality of wirings of the wiring board; and
a third bonding wire bonded to the third bonding pad of the first semiconductor chip and coupled to another one of the plurality of wirings of the wiring board,
wherein the second bonding wire overlaps with a first side of the first semiconductor chip in a plan view,
wherein the third bonding wire overlaps with a second side of the first semiconductor chip in a plan view,
wherein the first bonding wire directly connects the first bonding pad of the first semiconductor chip and the fourth bonding pad of the second semiconductor chip with the aid of a relay pad, and
wherein the first bonding wire overlaps with a third side of the first semiconductor chip in a plan view, the third side intersecting the first side and opposing the second side.
10. A radio frequency (RF) module according to claim 9 , wherein
the bipolar transistor of the amplifier circuit is a heterojunction bipolar transistor, and
the control circuit in the second semiconductor chip comprises a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
11. A radio frequency (RF) module according to claim 10 , wherein
the heterojunction bipolar transistor is formed over a substrate of compound semiconductor, and
the MOSFET is formed over a substrate of silicon.
12. A radio frequency (RF) module according to claim 9 , wherein
the amplifier circuit amplifies two or more input signals of different frequency bands, respectively.
13. A radio frequency (RF) module including:
a first semiconductor chip in which an amplifier circuit for amplifying an input RF signal and generating an output RF signal is formed,
the amplifier circuit comprising an input stage bipolar transistor and an output stage bipolar transistor electrically coupled in series each having a base, an emitter, and a collector,
the first semiconductor chip having a first bonding pad electrically coupled to the amplifier circuit, a second bonding pad electrically coupled to the base of the input stage bipolar transistor, and a third bonding pad electrically coupled to the collector of the output stage transistor;
a second semiconductor chip in which a control circuit controlling a base current of each of the input stage bipolar transistor and the output stage bipolar transistor is formed,
the second semiconductor chip having a fourth bonding pad electrically coupled to the control circuit;
a wiring board over which the first semiconductor chip and the second semiconductor chip are arranged adjacent to each other,
the wiring board having a plurality of wirings;
a first bonding wire bonded to the first bonding pad of the first semiconductor chip and the fourth bonding pad of the second semiconductor chip,
a control signal of the control circuit controlling the base current of the input stage bipolar transistor or the output stage bipolar transistor and being transmitted via the first bonding wire;
a second bonding wire bonded to the second bonding pad of the first semiconductor chip and coupled to one of the plurality of wirings of the wiring board; and
a third bonding wire bonded to the third bonding pad of the first semiconductor chip and coupled to another one of the plurality of wirings of the wiring board,
wherein the second bonding wire overlaps with a first side to the first semiconductor chip in a plan view,
wherein the third bonding wire overlaps with a second side of the first semiconductor chip in a plan view,
wherein the first bonding wire directly connects the first bonding pad of the first semiconductor chip and the fourth bonding pad of the second semiconductor chip without the aid of a relay pad, and
wherein the first bonding wire overlaps with a third side of the first semiconductor chip in a plan view, and the third side intersecting the first side and opposing the second side.
14. A radio frequency (RF) module according to claim 13 , wherein
each of the input stage bipolar transistor and the output stage bipolar transistor is a heterojunction bipolar transistor, and
the control circuit in the second semiconductor chip comprises a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
15. A radio frequency (RF) module according to claim 14 , wherein
the heterojunction bipolar transistor is formed over a substrate of compound semiconductor, and
the MOSFET is formed over a substrate of silicon.
16. A radio frequency (RF) module according to claim 13 , wherein
the amplifier circuit amplifies two or more input signals of different frequency bands, respectively.