IP Library › Granted Patent US 8,810,017
Granted Patent B2
US 8,810,017 · App. 13/536,321 · Granted Aug 19, 2014

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

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Quick Facts
Patent No.
US 8,810,017
App. No.
13/536,321
Filed
Jun 28, 2012
Granted
Aug 19, 2014
Kind
B2
Examiner
HO, TU TU V
Art Unit
2818
USPC
257/676
Abstract

A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

Claims (53)

1. A method of manufacture of an integrated circuit package system comprising:

attaching a first die to a first die pad;

connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die, the first die having a first contact pad, the second die having a second contact pad;

connecting a first lead adjacent the first die pad to the first contact pad with a first bond wire;

connecting a second lead to the second contact pad with a second bond wire, the second lead opposing the first lead and adjacent the second die, the second lead and the second die attached to a substrate having a ball pad; and

providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

2. The method as claimed in claim 1 wherein:

attaching the first die to the first die pad includes attaching the first die to a first frame having a first removable backing element connecting the first die pad and the first lead; and

further comprising:

removing the first removable backing element after connecting the second die to the first die.

3. The method as claimed in claim 1 further comprising:

forming the second lead on the substrate.

4. The method as claimed in claim 1 further comprising:

attaching a solder ball to the ball pad.

5. The method as claimed in claim 1 further comprising:

providing a wire lock on the first bond wire and the second bond wire.

6. A method of manufacture of an integrated circuit package system comprising:

attaching a first die to a first die pad, the first die including a first contact pad;

connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die, the second die including a second contact pad;

connecting a first lead adjacent the first die pad to the first die contact pad with a first bond wire;

connecting a second lead to the second contact pad with a second bond wire, the second lead opposing the first lead and adjacent the second die, the second lead and the second die attached to a substrate having a ball pad;

providing a wire lock on the first bond wire and the second bond wire; and

providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

7. The method as claimed in claim 6 wherein:

attaching the first die to the first die pad includes attaching the first die to a first frame having a first removable backing element connecting the first die pad and the first lead; and

further comprising:

removing the first removable backing element after connecting the second die to the first die.

8. The method as claimed in claim 6 further comprising:

forming the second lead on the substrate.

9. The method as claimed in claim 6 further comprising:

attaching a solder ball to the ball pad.

10. The method as claimed in claim 6 wherein connecting electrically the second die to the first die through the die interconnect includes the die interconnect having a flux material.

11. An integrated circuit package system comprising:

a first die pad;

a first die attached to the first die pad and electrically connected to a second die by a die interconnect positioned between the first die and the second die, the first die having a first contact pad, the second die having a second contact pad;

a first lead adjacent the first die pad;

a first bond wire connected between the first lead and the first contact pad;

a second lead opposing the first lead and adjacent the second die, the second lead connected to the second contact pad with a second bond wire;

a substrate with a ball pad attached to the second lead and the second die; and

a molding material surrounding the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

12. The system as claimed in claim 11 wherein the substrate is a laminate substrate.

13. The system as claimed in claim 11 further comprising:

a solder ball attached to the ball pad.

14. The system as claimed in claim 11 further comprising:

a portion of the second lead exposed.

15. The system as claimed in claim 11 wherein:

the die interconnect includes a solder bump.

16. The system as claimed in claim 11 wherein:

the die interconnect includes a solder bump with a flux material.

17. The system as claimed in claim 11 further comprising:

a wire lock on the first bond wire and the second bond wire.

18. The system as claimed in claim 11 wherein:

the second contact pad on the second die includes a flux material.