Micro-channel structure for micro-wires
View Patent ↗A micro-channel structure for facilitating the distribution of a curable ink includes a substrate and a single cured layer formed on the substrate. The single cured layer has one or more micro-channels adapted to receive curable ink embossed therein and an RMS surface roughness between or within micro-channels of less than or equal to 0.2 microns. Cured ink is located in each micro-channel. The thickness of the single cured layer is in a range of about two microns to ten microns greater than the micro-channel thickness.
1. A micro-channel structure for facilitating the distribution of a curable ink, comprising:
a substrate;
a single cured layer formed on the substrate, the single cured layer having one or more micro-channels embossed therein and an RMS surface roughness between or within micro-channels of less than or equal to 0.2 microns, wherein the micro-channels are adapted to receive curable ink;
cured ink in each micro-channel; and
wherein the thickness of the single cured layer is in a range of about two microns to ten microns greater than the micro-channel thickness and wherein the thickness of the single cured layer is in the range of about twelve microns to four microns.
2. The micro-channel structure of claim 1 , wherein the surface of the single cured layer is substantially planar.
3. The micro-channel structure of claim 1 , wherein the surface of the single cured layer has an RMS surface roughness of less than or equal to 0.1 microns.
4. The micro-channel structure of claim 1 , wherein the surface of the single cured layer has an RMS surface roughness of less than or equal to 0.05 microns.
5. The micro-channel structure of claim 1 , wherein the cured ink is a conductive ink forming a micro-wire in each micro-channel.
6. The micro-channel structure of claim 5 , wherein the cured conductive ink includes sintered electrically conductive nano-particles.
7. The method of claim 6 , wherein the electrically conductive nano-particles are silver, a silver alloy, include silver, or have an electrically conductive shell.
8. The micro-channel structure of claim 1 , wherein the substrate has a first side opposite and substantially parallel to a second side, the single cured layer is on the first side, and further including:
a second single cured layer formed on the substrate's second side, the second single cured layer having one or more second micro-channels formed therein and an RMS surface roughness between or within second micro-channels of less than or equal to 0.2 microns wherein the second micro-channels are adapted to receive curable ink;
cured ink in each second micro-channel; and
wherein the thickness of the second single cured layer is about two microns to ten microns greater than the second micro-channel thickness.
9. The micro-channel structure of claim 8 , wherein the cured ink is a conductive ink forming a micro-wire in each micro-channel and in each second micro-channel.
10. The micro-channel structure of claim 8 , wherein the thickness of the single cured layer is substantially equal to the thickness of the second single cured layer.
11. The micro-channel structure of claim 8 , wherein the thickness of the single cured layer is different from the thickness of the second single cured layer.
12. The micro-channel structure of claim 1 , wherein the width of the micro-channel is in the range of about twelve microns to two microns.
13. The micro-channel structure of claim 1 , wherein the thickness of the micro-channel is in the range of about ten microns to two microns.
14. The micro-channel structure of claim 1 , wherein the surface of the single cured layer has a water contact angle greater than 45 degrees.
15. The micro-channel structure of claim 1 , wherein the single cured layer has multiple sub-layers.