Cross-linked collagen comprising an antifungal agent
View Patent ↗The disclosure describes collagen constructs comprising antifungal agents, preferably, copper, and related methods.
1. An antifungal cross-linked collagen construct comprising: a cross-linked collagen comprising collagen and one or more cross-linking agents and an antifungal amount of copper incorporated into the construct, wherein at least a portion of the copper is chelated to one or more of the cross-linking agents, and at least another portion of the copper is bound to the construct via one or more of covalent, non-covalent, ionic, and metallic bonds.
2. The construct of claim 1 , wherein the cross-linking agent comprises a 1,2-benzoquinone and/or a 1,2-dihydroxy phenyl moiety.
3. The construct of claim 1 , wherein the cross-linked collagen construct is cross-linked with a cross-linking agent selected from the group consisting of nordihydroguaiaretic acid (NDGA), 3,4-dyhydroxyphenylalanine, dopamine, 3,4-dihydroxybenzaldehyde, 3,4-dihydroxybenzoic acid, a carbodiimide, glutaraldehyde or another dialdehyde, amultialdehyde, formaldehyde, tannic acid, isocyanates and epoxy resins.
4. The construct of claim 1 , wherein the cross-linked collagen construct is cross-linked with NDGA.
5. The construct of claim 1 , wherein the copper comprises copper (II).
6. The construct of claim 1 , wherein the copper comprises copper chloride, copper phosphate, copper sulfate, copper acetate, copper nitrate, copper fluoride, copper iodide, copper lactate, copper benzoate, copper bromide, copper carbonate, copper citrate, copper iodate, copper laurate, copper oxide, copper palmitate, copper protein, copper proteinate, copper imidazolate, colloidal copper, copper alloys, copper crystals, copper nanocrystals, copper plating, and/or copper sulfonamides.
7. The construct of claim 1 , wherein the copper incorporated into the construct is present in an amount of between about 0.1% to about 30%.
8. The construct of claim 1 , wherein the antifungal amount of copper is released in vivo in contact with an aqueous medium.
9. The construct of claim 1 , wherein the antifungal cross-linked collagen construct provides a sustained release of copper, wherein the sustained release comprises a plurality of release rates including an immediate release, an intermediate release, an extended release or any combination of release rates thereof.
10. The construct of claim 9 , wherein the plurality of release rates are adjusted to provide a suitable range of release rates, wherein the range of release rates comprises from about 1 minute to about 60 days, or any range therein.
11. A method of manufacturing an antifungal cross-linked collagen construct comprising a cross-linked collagen comprising collagen and one or more cross-linking agents and an antifungal amount of copper incorporated into the construct, wherein at least a portion of the copper is chelated to one or more of the cross-linking agents, and at least another portion of the copper is bound to the construct via one or more of covalent, non-covalent, ionic, and metallic bonds, the method comprising contacting the cross-linked collagen construct with copper to provide the antifungal cross-linked collagen construct.
12. A method of treating a subject suffering from a fungal disease comprising administering an antifungal cross-linked collagen construct in a subject, wherein the construct comprises cross-linked collagen comprising collagen and one or more cross-linking agents and copper incorporated therein, wherein at least a portion of the copper is chelated to one or more of the cross-linking agents, and at least another portion of the copper is bound to the construct via one or more of covalent, non-covalent, ionic, and metallic bonds, to release an effective amount of copper into the subject.